Intel U300E vs AMD Ryzen 7 PRO 6850U
Comparative analysis of Intel U300E and AMD Ryzen 7 PRO 6850U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel U300E
- CPU is newer: launch date 8 month(s) later
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- Around 10% better performance in PassMark - Single thread mark: 3546 vs 3233
Specifications (specs) | |
Launch date | 4 Jan 2023 vs 19 Apr 2022 |
Maximum core temperature | 100°C vs 95 °C |
Benchmarks | |
PassMark - Single thread mark | 3546 vs 3233 |
Reasons to consider the AMD Ryzen 7 PRO 6850U
- 3 more cores, run more applications at once: 8 vs 5
- 10 more threads: 16 vs 6
- Around 9% higher clock speed: 4.7 GHz vs 4.3 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 10 nm
- Around 28% more L1 cache; more data can be stored in the L1 cache for quick access later
- 838860.8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2097152x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.2x better performance in PassMark - CPU mark: 20778 vs 9478
Specifications (specs) | |
Number of cores | 8 vs 5 |
Number of threads | 16 vs 6 |
Maximum frequency | 4.7 GHz vs 4.3 GHz |
Manufacturing process technology | 6 nm vs 10 nm |
L1 cache | 512 KB vs 80K (per core) |
L2 cache | 4 MB vs 1.25MB (per core) |
L3 cache | 16 MB vs 8MB (shared) |
Benchmarks | |
PassMark - CPU mark | 20778 vs 9478 |
Compare benchmarks
CPU 1: Intel U300E
CPU 2: AMD Ryzen 7 PRO 6850U
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel U300E | AMD Ryzen 7 PRO 6850U |
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PassMark - Single thread mark | 3546 | 3233 |
PassMark - CPU mark | 9478 | 20778 |
Compare specifications (specs)
Intel U300E | AMD Ryzen 7 PRO 6850U | |
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Essentials |
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Launch date | 4 Jan 2023 | 19 Apr 2022 |
Place in performance rating | 476 | 462 |
Architecture codename | Zen 3+ | |
Vertical segment | Mobile | |
Performance |
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Base frequency | 1100 MHz | 2.7 GHz |
L1 cache | 80K (per core) | 512 KB |
L2 cache | 1.25MB (per core) | 4 MB |
L3 cache | 8MB (shared) | 16 MB |
Manufacturing process technology | 10 nm | 6 nm |
Maximum core temperature | 100°C | 95 °C |
Maximum frequency | 4.3 GHz | 4.7 GHz |
Number of cores | 5 | 8 |
Number of threads | 6 | 16 |
Unlocked | ||
Die size | 208 mm² | |
Memory |
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ECC memory support | ||
Supported memory types | DDR4, DDR5, Dual-channel | DDR5-4800 |
Max memory channels | 2 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | Intel BGA 1744 | FP7 |
Thermal Design Power (TDP) | 15 Watt | 15 Watt |
Configurable TDP | 15-28 Watt | |
Peripherals |
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PCIe configurations | Gen 4, 8 Lanes, (CPU only) | |
Max number of PCIe lanes | 20 | |
PCI Express revision | 4.0 | |
Graphics |
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Graphics max dynamic frequency | 2200 MHz | |
Graphics interfaces |
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DisplayPort | ||
HDMI |