Intel Xeon E-2314 vs Intel Xeon E5-2678 v3

Comparative analysis of Intel Xeon E-2314 and Intel Xeon E5-2678 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

Intel Xeon E-2314

Intel Xeon E5-2678 v3

Differences

Reasons to consider the Intel Xeon E-2314

A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
Around 85% lower typical power consumption: 65 Watt vs 120 Watt

Manufacturing process technology	14 nm vs 22 nm
Thermal Design Power (TDP)	65 Watt vs 120 Watt

Reasons to consider the Intel Xeon E5-2678 v3

8 more cores, run more applications at once: 12 vs 4
20 more threads: 24 vs 4
3x more L1 cache, more data can be stored in the L1 cache for quick access later
Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
3.8x more L3 cache, more data can be stored in the L3 cache for quick access later

Number of cores	12 vs 4
Number of threads	24 vs 4
L1 cache	768 KB vs 256 KB
L2 cache	3 MB vs 2 MB
L3 cache	30 MB vs 8 MB
Max number of CPUs in a configuration	2 vs 1

Compare benchmarks

CPU 1: Intel Xeon E-2314
CPU 2: Intel Xeon E5-2678 v3

Name	Intel Xeon E-2314	Intel Xeon E5-2678 v3
PassMark - Single thread mark	2686
PassMark - CPU mark	7951
3DMark Fire Strike - Physics Score		7451

Compare specifications (specs)

	Intel Xeon E-2314	Intel Xeon E5-2678 v3
Essentials
Architecture codename	Rocket Lake	Haswell-EP
Launch date	Q3'21
Launch price (MSRP)	$204
Place in performance rating	864	867
Processor Number	E-2314	E5-2678 v3
Series	Intel Xeon E Processor
Vertical segment	Server	Server
Family		Intel Xeon E5-2600 v3
Performance
64 bit support
Base frequency	2.80 GHz	2500 MHz
Bus Speed	8 GT/s	5 GT/s DMI
L1 cache	256 KB	768 KB
L2 cache	2 MB	3 MB
L3 cache	8 MB	30 MB
Manufacturing process technology	14 nm	22 nm
Maximum core temperature	100 °C
Maximum frequency	4.50 GHz
Number of cores	4	12
Number of threads	4	24
Memory
Max memory channels	2	2
Maximum memory size	128 GB
Supported memory types	DDR4-3200	DDR4
Compatibility
Max number of CPUs in a configuration	1	2
Package Size	37.5 mm x 37.5 mm
Sockets supported	FCLGA1200	LGA2011-3 (R3)
Thermal Design Power (TDP)	65 Watt	120 Watt
Peripherals
Max number of PCIe lanes	20	40
PCI Express revision	4.0	3.0
PCIe configurations	Up to 1x16+1x4, 2x8+1x4, 1x8+3x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® TSX-NI
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)