Intel Xeon E3-1225 v3 vs AMD Opteron 3350 HE

Comparative analysis of Intel Xeon E3-1225 v3 and AMD Opteron 3350 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps).

Intel Xeon E3-1225 v3

AMD Opteron 3350 HE

Differences

Reasons to consider the Intel Xeon E3-1225 v3

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 59% better performance in PassMark - Single thread mark: 2010 vs 1263
Around 32% better performance in PassMark - CPU mark: 5307 vs 4009

Specifications (specs)
Manufacturing process technology	22 nm vs 32 nm
L1 cache	64 KB (per core) vs 192 KB
Benchmarks
PassMark - Single thread mark	2010 vs 1263
PassMark - CPU mark	5307 vs 4009

Reasons to consider the AMD Opteron 3350 HE

Around 6% higher clock speed: 3.8 GHz vs 3.60 GHz
4x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 87% lower typical power consumption: 45 Watt vs 84 Watt

Maximum frequency	3.8 GHz vs 3.60 GHz
L2 cache	4 MB vs 256 KB (per core)
Thermal Design Power (TDP)	45 Watt vs 84 Watt

Compare benchmarks

CPU 1: Intel Xeon E3-1225 v3
CPU 2: AMD Opteron 3350 HE

PassMark - Single thread mark

CPU 1

CPU 2

2010

1263

PassMark - CPU mark

CPU 1

CPU 2

5307

4009

Name	Intel Xeon E3-1225 v3	AMD Opteron 3350 HE
PassMark - Single thread mark	2010	1263
PassMark - CPU mark	5307	4009
Geekbench 4 - Single Core	758
Geekbench 4 - Multi-Core	2618
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	3.617
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	76.398
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.422
CompuBench 1.5 Desktop - Video Composition (Frames/s)	2.054
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	5.994
GFXBench 4.0 - Car Chase Offscreen (Frames)	987
GFXBench 4.0 - Manhattan (Frames)	2348
GFXBench 4.0 - Car Chase Offscreen (Fps)	987
GFXBench 4.0 - Manhattan (Fps)	2348

Compare specifications (specs)

	Intel Xeon E3-1225 v3	AMD Opteron 3350 HE
Essentials
Architecture codename	Haswell	Delhi
Launch date	June 2013	n/d
Launch price (MSRP)	$384
Place in performance rating	1924	1912
Price now	$458.34
Processor Number	E3-1225V3
Series	Intel® Xeon® Processor E3 v3 Family	AMD Opteron 3300 Series Processor
Status	Launched
Value for money (0-100)	4.63
Vertical segment	Server	Server
Family		AMD Opteron
OPN Tray		OS3350HOW4KHK
Performance
64 bit support
Base frequency	3.20 GHz	2.8 GHz
Bus Speed	5 GT/s DMI
Die size	160 mm	315 mm
L1 cache	64 KB (per core)	192 KB
L2 cache	256 KB (per core)	4 MB
L3 cache	8192 KB (shared)	8 MB
Manufacturing process technology	22 nm	32 nm
Maximum frequency	3.60 GHz	3.8 GHz
Number of cores	4	4
Number of QPI Links	0
Number of threads	4	4
Transistor count	1400 million	1200 million
Maximum core temperature		69.10°C
Unlocked
Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 and DDR3L 1333/1600 at 1.5V	DDR3
Supported memory frequency		2000 MHz
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.20 GHz
Graphics max frequency	1.2 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics P4600
Graphics interfaces
Number of displays supported	3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150	AM3+
Thermal Design Power (TDP)	84 Watt	45 Watt
Thermal Solution	PCG 2013D
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	1x16, 2x8, 1x8/2x4
Scalability	1S Only
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Fused Multiply-Add (FMA)
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)