Intel Xeon E3-1230 v2 vs Intel Xeon X5560
Comparative analysis of Intel Xeon E3-1230 v2 and Intel Xeon X5560 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E3-1230 v2
- CPU is newer: launch date 3 year(s) 2 month(s) later
- Around 16% higher clock speed: 3.70 GHz vs 3.20 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 38% lower typical power consumption: 69 Watt vs 95 Watt
- Around 52% better performance in PassMark - Single thread mark: 1988 vs 1305
- Around 11% better performance in PassMark - CPU mark: 6195 vs 5572
- Around 60% better performance in Geekbench 4 - Single Core: 766 vs 479
- Around 51% better performance in Geekbench 4 - Multi-Core: 2984 vs 1982
Specifications (specs) | |
Launch date | May 2012 vs March 2009 |
Maximum frequency | 3.70 GHz vs 3.20 GHz |
Manufacturing process technology | 22 nm vs 45 nm |
Thermal Design Power (TDP) | 69 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 1988 vs 1305 |
PassMark - CPU mark | 6195 vs 5572 |
Geekbench 4 - Single Core | 766 vs 479 |
Geekbench 4 - Multi-Core | 2984 vs 1982 |
Reasons to consider the Intel Xeon X5560
- Around 14% higher maximum core temperature: 75°C vs 65.8°C
- 4.4x more maximum memory size: 144 GB vs 32.77 GB
Maximum core temperature | 75°C vs 65.8°C |
Maximum memory size | 144 GB vs 32.77 GB |
Max number of CPUs in a configuration | 2 vs 1 |
Compare benchmarks
CPU 1: Intel Xeon E3-1230 v2
CPU 2: Intel Xeon X5560
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon E3-1230 v2 | Intel Xeon X5560 |
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PassMark - Single thread mark | 1988 | 1305 |
PassMark - CPU mark | 6195 | 5572 |
Geekbench 4 - Single Core | 766 | 479 |
Geekbench 4 - Multi-Core | 2984 | 1982 |
3DMark Fire Strike - Physics Score | 1873 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.493 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 78.109 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.544 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.162 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.824 |
Compare specifications (specs)
Intel Xeon E3-1230 v2 | Intel Xeon X5560 | |
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Essentials |
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Architecture codename | Ivy Bridge | Nehalem EP |
Launch date | May 2012 | March 2009 |
Launch price (MSRP) | $360 | $44 |
Place in performance rating | 2262 | 2234 |
Price now | $352.10 | $57.95 |
Processor Number | E3-1230V2 | X5560 |
Series | Intel® Xeon® Processor E3 v2 Family | Legacy Intel® Xeon® Processors |
Status | Discontinued | Launched |
Value for money (0-100) | 7.41 | 27.43 |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 3.30 GHz | 2.80 GHz |
Bus Speed | 5 GT/s DMI | 6.4 GT/s QPI |
Die size | 160 mm | 263 mm2 |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 8192 KB (shared) | 8192 KB (shared) |
Manufacturing process technology | 22 nm | 45 nm |
Maximum core temperature | 65.8°C | 75°C |
Maximum frequency | 3.70 GHz | 3.20 GHz |
Number of cores | 4 | 4 |
Number of threads | 8 | 8 |
Transistor count | 1400 million | 731 million |
Number of QPI Links | 2 | |
VID voltage range | 0.75V -1.35V | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 3 |
Maximum memory bandwidth | 25.6 GB/s | 32 GB/s |
Maximum memory size | 32.77 GB | 144 GB |
Supported memory types | DDR3 1333/1600 | DDR3 800/1066/1333 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 2 |
Package Size | 37.5mm x 37.5mm | 42.5mm x 45mm |
Sockets supported | FCLGA1155 | FCLGA1366 |
Thermal Design Power (TDP) | 69 Watt | 95 Watt |
Peripherals |
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PCI Express revision | 3.0 | |
PCIe configurations | 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Physical Address Extensions (PAE) | 40-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |