Intel Xeon E3-1230 v3 vs Intel Xeon E5-1650

Comparative analysis of Intel Xeon E3-1230 v3 and Intel Xeon E5-1650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Xeon E3-1230 v3

  • CPU is newer: launch date 1 year(s) 3 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • Around 63% lower typical power consumption: 80 Watt vs 130 Watt
  • Around 20% better performance in PassMark - Single thread mark: 2080 vs 1736
  • Around 20% better performance in Geekbench 4 - Single Core: 865 vs 720
  • Around 42% better performance in CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s): 83.748 vs 58.993
Specifications (specs)
Launch date June 2013 vs March 2012
Manufacturing process technology 22 nm vs 32 nm
Thermal Design Power (TDP) 80 Watt vs 130 Watt
Benchmarks
PassMark - Single thread mark 2080 vs 1736
Geekbench 4 - Single Core 865 vs 720
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 83.748 vs 58.993

Reasons to consider the Intel Xeon E5-1650

  • 2 more cores, run more applications at once: 6 vs 4
  • 4 more threads: 12 vs 8
  • Around 3% higher clock speed: 3.80 GHz vs 3.70 GHz
  • Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
  • Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
  • 8x more maximum memory size: 256 GB vs 32 GB
  • Around 19% better performance in PassMark - CPU mark: 8113 vs 6817
  • Around 32% better performance in Geekbench 4 - Multi-Core: 4316 vs 3280
  • Around 31% better performance in 3DMark Fire Strike - Physics Score: 4806 vs 3655
  • Around 22% better performance in CompuBench 1.5 Desktop - Face Detection (mPixels/s): 5.872 vs 4.829
  • Around 19% better performance in CompuBench 1.5 Desktop - T-Rex (Frames/s): 0.698 vs 0.585
  • Around 18% better performance in CompuBench 1.5 Desktop - Video Composition (Frames/s): 2.804 vs 2.375
  • Around 14% better performance in CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s): 6.722 vs 5.897
Specifications (specs)
Number of cores 6 vs 4
Number of threads 12 vs 8
Maximum frequency 3.80 GHz vs 3.70 GHz
L1 cache 64 KB (per core) vs 64 KB (per core)
L2 cache 256 KB (per core) vs 256 KB (per core)
L3 cache 12288 KB (shared) vs 8192 KB (shared)
Maximum memory size 256 GB vs 32 GB
Benchmarks
PassMark - CPU mark 8113 vs 6817
Geekbench 4 - Multi-Core 4316 vs 3280
3DMark Fire Strike - Physics Score 4806 vs 3655
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 5.872 vs 4.829
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.698 vs 0.585
CompuBench 1.5 Desktop - Video Composition (Frames/s) 2.804 vs 2.375
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 6.722 vs 5.897

Compare benchmarks

CPU 1: Intel Xeon E3-1230 v3
CPU 2: Intel Xeon E5-1650

PassMark - Single thread mark
CPU 1
CPU 2
2080
1736
PassMark - CPU mark
CPU 1
CPU 2
6817
8113
Geekbench 4 - Single Core
CPU 1
CPU 2
865
720
Geekbench 4 - Multi-Core
CPU 1
CPU 2
3280
4316
3DMark Fire Strike - Physics Score
CPU 1
CPU 2
3655
4806
CompuBench 1.5 Desktop - Face Detection (mPixels/s)
CPU 1
CPU 2
4.829
5.872
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)
CPU 1
CPU 2
83.748
58.993
CompuBench 1.5 Desktop - T-Rex (Frames/s)
CPU 1
CPU 2
0.585
0.698
CompuBench 1.5 Desktop - Video Composition (Frames/s)
CPU 1
CPU 2
2.375
2.804
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)
CPU 1
CPU 2
5.897
6.722
Name Intel Xeon E3-1230 v3 Intel Xeon E5-1650
PassMark - Single thread mark 2080 1736
PassMark - CPU mark 6817 8113
Geekbench 4 - Single Core 865 720
Geekbench 4 - Multi-Core 3280 4316
3DMark Fire Strike - Physics Score 3655 4806
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 4.829 5.872
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 83.748 58.993
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.585 0.698
CompuBench 1.5 Desktop - Video Composition (Frames/s) 2.375 2.804
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 5.897 6.722

Compare specifications (specs)

Intel Xeon E3-1230 v3 Intel Xeon E5-1650

Essentials

Architecture codename Haswell Sandy Bridge EP
Launch date June 2013 March 2012
Launch price (MSRP) $264 $175
Place in performance rating 2106 2108
Price now $261.66 $175
Processor Number E3-1230 v3 E5-1650
Series Intel® Xeon® Processor E3 v3 Family Intel® Xeon® Processor E5 Family
Status Discontinued Discontinued
Value for money (0-100) 10.50 19.77
Vertical segment Server Server

Performance

64 bit support
Base frequency 3.30 GHz 3.20 GHz
Bus Speed 5 GT/s DMI 0 QPI
Die size 160 mm 435 mm
L1 cache 64 KB (per core) 64 KB (per core)
L2 cache 256 KB (per core) 256 KB (per core)
L3 cache 8192 KB (shared) 12288 KB (shared)
Manufacturing process technology 22 nm 32 nm
Maximum frequency 3.70 GHz 3.80 GHz
Number of cores 4 6
Number of QPI Links 0 0
Number of threads 8 12
Transistor count 1400 million 2270 million
Maximum core temperature 64.0°C
VID voltage range 0.60V - 1.35V

Memory

ECC memory support
Max memory channels 2 4
Maximum memory bandwidth 25.6 GB/s 51.2 GB/s
Maximum memory size 32 GB 256 GB
Supported memory types DDR3 and DDR3L 1333/1600 at 1.5V DDR3 800/1066/1333/1600

Graphics

Processor graphics None

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm 52.5mm x 45.0 mm
Sockets supported FCLGA1150 FCLGA2011
Thermal Design Power (TDP) 80 Watt 130 Watt
Thermal Solution PCG 2013D

Peripherals

Max number of PCIe lanes 16 40
PCI Express revision 3.0 3.0
PCIe configurations 1x16, 2x8, 1x8/2x4
Scalability 1S Only

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Intel® Demand Based Switching

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)