Intel Xeon E3-1230 v6 vs Intel Xeon E3-1275
Comparative analysis of Intel Xeon E3-1230 v6 and Intel Xeon E3-1275 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Xeon E3-1230 v6
- Around 3% higher clock speed: 3.90 GHz vs 3.80 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- 2x more maximum memory size: 64 GB vs 32 GB
- Around 32% lower typical power consumption: 72 Watt vs 95 Watt
- Around 24% better performance in PassMark - Single thread mark: 2206 vs 1773
- Around 49% better performance in PassMark - CPU mark: 8229 vs 5516
Specifications (specs) | |
Maximum frequency | 3.90 GHz vs 3.80 GHz |
Manufacturing process technology | 14 nm vs 32 nm |
Maximum memory size | 64 GB vs 32 GB |
Thermal Design Power (TDP) | 72 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 2206 vs 1773 |
PassMark - CPU mark | 8229 vs 5516 |
Compare benchmarks
CPU 1: Intel Xeon E3-1230 v6
CPU 2: Intel Xeon E3-1275
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E3-1230 v6 | Intel Xeon E3-1275 |
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PassMark - Single thread mark | 2206 | 1773 |
PassMark - CPU mark | 8229 | 5516 |
Geekbench 4 - Single Core | 996 | |
Geekbench 4 - Multi-Core | 3972 |
Compare specifications (specs)
Intel Xeon E3-1230 v6 | Intel Xeon E3-1275 | |
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Essentials |
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Architecture codename | Kaby Lake | Sandy Bridge |
Launch date | Q1'17 | April 2011 |
Place in performance rating | 1408 | 1411 |
Processor Number | E3-1230V6 | E3-1275 |
Series | Intel® Xeon® Processor E3 v6 Family | Intel® Xeon® Processor E3 Family |
Status | Launched | Discontinued |
Vertical segment | Server | Server |
Launch price (MSRP) | $450 | |
Price now | $304 | |
Value for money (0-100) | 8.09 | |
Performance |
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64 bit support | ||
Base frequency | 3.50 GHz | 3.40 GHz |
Bus Speed | 8 GT/s DMI3 | 5 GT/s DMI |
Manufacturing process technology | 14 nm | 32 nm |
Maximum frequency | 3.90 GHz | 3.80 GHz |
Number of cores | 4 | 4 |
Number of threads | 8 | 8 |
VID voltage range | 0.55V-1.52V | |
Die size | 216 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 8192 KB (shared) | |
Maximum core temperature | 72.6°C | |
Transistor count | 1160 million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 37.5 GB/s | 21 GB/s |
Maximum memory size | 64 GB | 32 GB |
Supported memory types | DDR4-2400, DDR3L-1866 | DDR3 1066/1333 |
ECC memory support | ||
Graphics |
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Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics base frequency | 850 MHz | |
Graphics max dynamic frequency | 1.35 GHz | |
Graphics max frequency | 1.35 GHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics P3000 | |
Graphics interfaces |
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Number of displays supported | 0 | 2 |
Wireless Display (WiDi) support | ||
Graphics image quality |
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4K resolution support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA1151 | LGA1155 |
Thermal Design Power (TDP) | 72 Watt | 95 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 20 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Intel® Identity Protection technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |