Intel Xeon E5-2603 v4 vs Intel Xeon X5690
Comparative analysis of Intel Xeon E5-2603 v4 and Intel Xeon X5690 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-2603 v4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- 5.3x more maximum memory size: 1.5 TB vs 288 GB
- Around 53% lower typical power consumption: 85 Watt vs 130 Watt
Manufacturing process technology | 14 nm vs 32 nm |
Maximum memory size | 1.5 TB vs 288 GB |
Thermal Design Power (TDP) | 85 Watt vs 130 Watt |
Reasons to consider the Intel Xeon X5690
- 6 more threads: 12 vs 6
- Around 8% higher maximum core temperature: 78.5°C vs 73°C
- Around 58% better performance in PassMark - Single thread mark: 1713 vs 1081
- Around 62% better performance in PassMark - CPU mark: 12940 vs 7992
- Around 35% better performance in Geekbench 4 - Single Core: 637 vs 471
- Around 48% better performance in Geekbench 4 - Multi-Core: 3517 vs 2370
Specifications (specs) | |
Number of threads | 12 vs 6 |
Maximum core temperature | 78.5°C vs 73°C |
Benchmarks | |
PassMark - Single thread mark | 1713 vs 1081 |
PassMark - CPU mark | 12940 vs 7992 |
Geekbench 4 - Single Core | 637 vs 471 |
Geekbench 4 - Multi-Core | 3517 vs 2370 |
Compare benchmarks
CPU 1: Intel Xeon E5-2603 v4
CPU 2: Intel Xeon X5690
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
||||
Geekbench 4 - Single Core |
|
|
||||
Geekbench 4 - Multi-Core |
|
|
Name | Intel Xeon E5-2603 v4 | Intel Xeon X5690 |
---|---|---|
PassMark - Single thread mark | 1081 | 1713 |
PassMark - CPU mark | 7992 | 12940 |
Geekbench 4 - Single Core | 471 | 637 |
Geekbench 4 - Multi-Core | 2370 | 3517 |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.301 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 57.148 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.762 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.122 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 15.77 |
Compare specifications (specs)
Intel Xeon E5-2603 v4 | Intel Xeon X5690 | |
---|---|---|
Essentials |
||
Architecture codename | Broadwell | Westmere EP |
Launch date | Q1'16 | February 2011 |
Place in performance rating | 2275 | 2252 |
Processor Number | E5-2603V4 | X5690 |
Series | Intel® Xeon® Processor E5 v4 Family | Legacy Intel® Xeon® Processors |
Status | Launched | Discontinued |
Vertical segment | Server | Server |
Launch price (MSRP) | $205 | |
Price now | $149 | |
Value for money (0-100) | 17.68 | |
Performance |
||
64 bit support | ||
Base frequency | 1.70 GHz | 3.46 GHz |
Bus Speed | 6.4 GT/s QPI | 6.4 GT/s QPI |
Manufacturing process technology | 14 nm | 32 nm |
Maximum core temperature | 73°C | 78.5°C |
Number of cores | 6 | 6 |
Number of QPI Links | 2 | 2 |
Number of threads | 6 | 12 |
VID voltage range | 0 | 0.750V-1.350V |
Die size | 239 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 12288 KB (shared) | |
Maximum frequency | 3.73 GHz | |
Transistor count | 1170 million | |
Memory |
||
Max memory channels | 4 | 3 |
Maximum memory bandwidth | 59.7 GB/s | 32 GB/s |
Maximum memory size | 1.5 TB | 288 GB |
Supported memory types | DDR4 1600/1866 | DDR3 800/1066/1333 |
ECC memory support | ||
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 2 |
Package Size | 45mm x 52.5mm | 42.5mm X 45mm |
Sockets supported | FCLGA2011-3 | FCLGA1366 |
Thermal Design Power (TDP) | 85 Watt | 130 Watt |
Peripherals |
||
Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | Intel® SSE4.2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | 40-bit |
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |