Intel Xeon E5-2628L v4 vs Intel Core i3-9000

Comparative analysis of Intel Xeon E5-2628L v4 and Intel Core i3-9000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon E5-2628L v4

  • 8 more cores, run more applications at once: 12 vs 4
Number of cores 12 vs 4
Max number of CPUs in a configuration 2 vs 1

Reasons to consider the Intel Core i3-9000

  • Around 54% higher clock speed: 3.7 GHz vs 2.40 GHz
  • Around 15% lower typical power consumption: 65 Watt vs 75 Watt
Maximum frequency 3.7 GHz vs 2.40 GHz
Thermal Design Power (TDP) 65 Watt vs 75 Watt

Compare benchmarks

CPU 1: Intel Xeon E5-2628L v4
CPU 2: Intel Core i3-9000

Name Intel Xeon E5-2628L v4 Intel Core i3-9000
PassMark - Single thread mark 1462
PassMark - CPU mark 18895
Geekbench 4 - Single Core 2888
Geekbench 4 - Multi-Core 18925

Compare specifications (specs)

Intel Xeon E5-2628L v4 Intel Core i3-9000

Essentials

Architecture codename Broadwell Coffee Lake
Launch date Q1'16 September 2018
Place in performance rating 567 not rated
Processor Number E5-2628LV4
Series Intel® Xeon® Processor E5 v4 Family
Status Launched
Vertical segment Embedded Desktop

Performance

64 bit support
Base frequency 1.90 GHz
Bus Speed 8 GT/s QPI
Manufacturing process technology 14 nm 14 nm
Maximum core temperature 87°C
Maximum frequency 2.40 GHz 3.7 GHz
Number of cores 12 4
Number of QPI Links 2
Number of threads 24
VID voltage range 0
L1 cache 64K (per core)
L2 cache 256K (per core)
L3 cache 6 MB (shared)
Maximum case temperature (TCase) 72 °C

Memory

Max memory channels 4
Maximum memory bandwidth 68.3 GB/s
Maximum memory size 1.5 TB
Supported memory types DDR4 1600/1866/2133 DDR4

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 45mm x 52.5mm
Sockets supported FCLGA2011-3
Thermal Design Power (TDP) 75 Watt 65 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)