Intel Xeon E5-2637 v2 vs Intel Xeon W5590
Comparative analysis of Intel Xeon E5-2637 v2 and Intel Xeon W5590 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-2637 v2
- CPU is newer: launch date 4 year(s) 1 month(s) later
- Around 6% higher clock speed: 3.80 GHz vs 3.60 GHz
- Around 13% higher maximum core temperature: 76°C vs 67°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 25% more L3 cache; more data can be stored in the L3 cache for quick access later
- 5.3x more maximum memory size: 768 GB vs 144 GB
- Around 19% better performance in PassMark - Single thread mark: 1917 vs 1612
- Around 81% better performance in PassMark - CPU mark: 12040 vs 6640
Specifications (specs) | |
Launch date | September 2013 vs August 2009 |
Maximum frequency | 3.80 GHz vs 3.60 GHz |
Maximum core temperature | 76°C vs 67°C |
Manufacturing process technology | 22 nm vs 45 nm |
L3 cache | 10240 KB (shared) vs 8192 KB (shared) |
Maximum memory size | 768 GB vs 144 GB |
Benchmarks | |
PassMark - Single thread mark | 1917 vs 1612 |
PassMark - CPU mark | 12040 vs 6640 |
Reasons to consider the Intel Xeon W5590
- 3.8x better performance in Geekbench 4 - Single Core: 2806 vs 748
- 3.2x better performance in Geekbench 4 - Multi-Core: 10032 vs 3176
Benchmarks | |
Geekbench 4 - Single Core | 2806 vs 748 |
Geekbench 4 - Multi-Core | 10032 vs 3176 |
Compare benchmarks
CPU 1: Intel Xeon E5-2637 v2
CPU 2: Intel Xeon W5590
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon E5-2637 v2 | Intel Xeon W5590 |
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PassMark - Single thread mark | 1917 | 1612 |
PassMark - CPU mark | 12040 | 6640 |
Geekbench 4 - Single Core | 748 | 2806 |
Geekbench 4 - Multi-Core | 3176 | 10032 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.073 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 83.554 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.602 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.434 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 10.152 |
Compare specifications (specs)
Intel Xeon E5-2637 v2 | Intel Xeon W5590 | |
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Essentials |
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Architecture codename | Ivy Bridge EP | Nehalem EP |
Launch date | September 2013 | August 2009 |
Launch price (MSRP) | $1,090 | $270 |
Place in performance rating | 1606 | 1619 |
Price now | $709 | $2,508.95 |
Processor Number | E5-2637V2 | W5590 |
Series | Intel® Xeon® Processor E5 v2 Family | Legacy Intel® Xeon® Processors |
Status | Launched | Launched |
Value for money (0-100) | 3.91 | 0.73 |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 3.50 GHz | 3.33 GHz |
Bus Speed | 8 GT/s QPI | 6.4 GT/s QPI |
Die size | 160 mm | 263 mm2 |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 10240 KB (shared) | 8192 KB (shared) |
Manufacturing process technology | 22 nm | 45 nm |
Maximum core temperature | 76°C | 67°C |
Maximum frequency | 3.80 GHz | 3.60 GHz |
Number of cores | 4 | 4 |
Number of QPI Links | 2 | 2 |
Number of threads | 8 | 8 |
Transistor count | 1400 million | 731 million |
VID voltage range | 0.65–1.30V | 0.75V -1.35V |
Memory |
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ECC memory support | ||
Max memory channels | 4 | 3 |
Maximum memory bandwidth | 59.7 GB/s | 32 GB/s |
Maximum memory size | 768 GB | 144 GB |
Supported memory types | DDR3 800/1066/1333/1600/1866 | DDR3 800/1066/1333 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 2 |
Package Size | 52.5mm x 45mm | 42.5mm x 45mm |
Sockets supported | FCLGA2011 | FCLGA1366 |
Thermal Design Power (TDP) | 130 Watt | 130 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | 40-bit |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |