Intel Xeon E5-2670 v3 vs Intel Core i7-2600

Comparative analysis of Intel Xeon E5-2670 v3 and Intel Core i7-2600 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Xeon E5-2670 v3

  • 8 more cores, run more applications at once: 12 vs 4
  • 16 more threads: 24 vs 8
  • Around 16% higher maximum core temperature: 84.5°C vs 72.6°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • 24x more maximum memory size: 768 GB vs 32 GB
  • 4.1x better performance in PassMark - CPU mark: 22166 vs 5348
  • 2.6x better performance in Geekbench 4 - Multi-Core: 7047 vs 2727
Specifications (specs)
Number of cores 12 vs 4
Number of threads 24 vs 8
Maximum core temperature 84.5°C vs 72.6°C
Manufacturing process technology 22 nm vs 32 nm
Maximum memory size 768 GB vs 32 GB
Max number of CPUs in a configuration 2 vs 1
Benchmarks
PassMark - CPU mark 22166 vs 5348
Geekbench 4 - Multi-Core 7047 vs 2727

Reasons to consider the Intel Core i7-2600

  • Around 23% higher clock speed: 3.80 GHz vs 3.10 GHz
  • Around 26% lower typical power consumption: 95 Watt vs 120 Watt
  • Around 3% better performance in PassMark - Single thread mark: 1737 vs 1694
  • Around 3% better performance in Geekbench 4 - Single Core: 727 vs 705
Specifications (specs)
Maximum frequency 3.80 GHz vs 3.10 GHz
Thermal Design Power (TDP) 95 Watt vs 120 Watt
Benchmarks
PassMark - Single thread mark 1737 vs 1694
Geekbench 4 - Single Core 727 vs 705

Compare benchmarks

CPU 1: Intel Xeon E5-2670 v3
CPU 2: Intel Core i7-2600

PassMark - Single thread mark
CPU 1
CPU 2
1694
1737
PassMark - CPU mark
CPU 1
CPU 2
22166
5348
Geekbench 4 - Single Core
CPU 1
CPU 2
705
727
Geekbench 4 - Multi-Core
CPU 1
CPU 2
7047
2727
Name Intel Xeon E5-2670 v3 Intel Core i7-2600
PassMark - Single thread mark 1694 1737
PassMark - CPU mark 22166 5348
Geekbench 4 - Single Core 705 727
Geekbench 4 - Multi-Core 7047 2727
3DMark Fire Strike - Physics Score 3000
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 4.393
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 74.312
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.54
CompuBench 1.5 Desktop - Video Composition (Frames/s) 2.109
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 5.019

Compare specifications (specs)

Intel Xeon E5-2670 v3 Intel Core i7-2600

Essentials

Architecture codename Haswell Sandy Bridge
Launch date Q3'14 January 2011
Place in performance rating 1411 2313
Processor Number E5-2670V3 i7-2600
Series Intel® Xeon® Processor E5 v3 Family Legacy Intel® Core™ Processors
Status Launched Launched
Vertical segment Server Desktop
Launch price (MSRP) $247
Price now $148.99
Value for money (0-100) 16.20

Performance

64 bit support
Base frequency 2.30 GHz 3.40 GHz
Bus Speed 9.6 GT/s QPI 5 GT/s DMI
Manufacturing process technology 22 nm 32 nm
Maximum core temperature 84.5°C 72.6°C
Maximum frequency 3.10 GHz 3.80 GHz
Number of cores 12 4
Number of QPI Links 2
Number of threads 24 8
VID voltage range 0.65V–1.30V
Die size 216 mm
L1 cache 64 KB (per core)
L2 cache 256 KB (per core)
L3 cache 8192 KB (shared)
Transistor count 1160 million

Memory

Max memory channels 4 2
Maximum memory bandwidth 68 GB/s 21 GB/s
Maximum memory size 768 GB 32 GB
Supported memory types DDR4 1600/1866/2133 DDR3 1066/1333

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 52.5mm x 45mm 37.5mm x 37.5mm
Sockets supported FCLGA2011-3 LGA1155
Thermal Design Power (TDP) 120 Watt 95 Watt

Peripherals

Max number of PCIe lanes 40 16
PCI Express revision 3.0 2.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2 Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Advanced Vector Extensions (AVX)
Intel® Fast Memory Access

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Graphics

Device ID 0x102
Graphics base frequency 850 MHz
Graphics max dynamic frequency 1.35 GHz
Graphics max frequency 1.35 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 2000

Graphics interfaces

Number of displays supported 2
Wireless Display (WiDi) support