Intel Xeon E5-2670 v3 vs Intel Xeon E5-2670 v2
Comparative analysis of Intel Xeon E5-2670 v3 and Intel Xeon E5-2670 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-2670 v3
- 2 more cores, run more applications at once: 12 vs 10
- 4 more threads: 24 vs 20
- Around 3% higher maximum core temperature: 84.5°C vs 82°C
- Around 7% better performance in PassMark - Single thread mark: 1694 vs 1587
- Around 17% better performance in PassMark - CPU mark: 22166 vs 18965
- Around 29% better performance in Geekbench 4 - Single Core: 705 vs 546
- Around 14% better performance in Geekbench 4 - Multi-Core: 7047 vs 6174
| Specifications (specs) | |
| Number of cores | 12 vs 10 |
| Number of threads | 24 vs 20 |
| Maximum core temperature | 84.5°C vs 82°C |
| Benchmarks | |
| PassMark - Single thread mark | 1694 vs 1587 |
| PassMark - CPU mark | 22166 vs 18965 |
| Geekbench 4 - Single Core | 705 vs 546 |
| Geekbench 4 - Multi-Core | 7047 vs 6174 |
Reasons to consider the Intel Xeon E5-2670 v2
- Around 6% higher clock speed: 3.30 GHz vs 3.10 GHz
- Around 4% lower typical power consumption: 115 Watt vs 120 Watt
| Maximum frequency | 3.30 GHz vs 3.10 GHz |
| Thermal Design Power (TDP) | 115 Watt vs 120 Watt |
Compare benchmarks
CPU 1: Intel Xeon E5-2670 v3
CPU 2: Intel Xeon E5-2670 v2
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Xeon E5-2670 v3 | Intel Xeon E5-2670 v2 |
|---|---|---|
| PassMark - Single thread mark | 1694 | 1587 |
| PassMark - CPU mark | 22166 | 18965 |
| Geekbench 4 - Single Core | 705 | 546 |
| Geekbench 4 - Multi-Core | 7047 | 6174 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 8.749 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 70.641 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.994 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 4.413 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 12.303 |
Compare specifications (specs)
| Intel Xeon E5-2670 v3 | Intel Xeon E5-2670 v2 | |
|---|---|---|
Essentials |
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| Architecture codename | Haswell | Ivy Bridge EP |
| Launch date | Q3'14 | September 2013 |
| Place in performance rating | 1411 | 1944 |
| Processor Number | E5-2670V3 | E5-2670V2 |
| Series | Intel® Xeon® Processor E5 v3 Family | Intel® Xeon® Processor E5 v2 Family |
| Status | Launched | Launched |
| Vertical segment | Server | Server |
| Launch price (MSRP) | $927 | |
| Price now | $489 | |
| Value for money (0-100) | 9.03 | |
Performance |
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| 64 bit support | ||
| Base frequency | 2.30 GHz | 2.50 GHz |
| Bus Speed | 9.6 GT/s QPI | 8 GT/s QPI |
| Manufacturing process technology | 22 nm | 22 nm |
| Maximum core temperature | 84.5°C | 82°C |
| Maximum frequency | 3.10 GHz | 3.30 GHz |
| Number of cores | 12 | 10 |
| Number of QPI Links | 2 | 2 |
| Number of threads | 24 | 20 |
| VID voltage range | 0.65V–1.30V | 0.65–1.30V |
| Die size | 160 mm | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| L3 cache | 25600 KB (shared) | |
| Transistor count | 1400 million | |
Memory |
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| Max memory channels | 4 | 4 |
| Maximum memory bandwidth | 68 GB/s | 59.7 GB/s |
| Maximum memory size | 768 GB | 768 GB |
| Supported memory types | DDR4 1600/1866/2133 | DDR3 800/1066/1333/1600/1866 |
| ECC memory support | ||
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 2 | 2 |
| Package Size | 52.5mm x 45mm | 52.5mm x 45mm |
| Sockets supported | FCLGA2011-3 | FCLGA2011 |
| Thermal Design Power (TDP) | 120 Watt | 115 Watt |
Peripherals |
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| Max number of PCIe lanes | 40 | 40 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | x4, x8, x16 | x4, x8, x16 |
| Scalability | 2S | 2S Only |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX2 | Intel® AVX |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 46-bit | 46-bit |
| Thermal Monitoring | ||
| Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
