Intel Xeon E5-2687W v3 vs Intel Core i7-860

Comparative analysis of Intel Xeon E5-2687W v3 and Intel Core i7-860 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Xeon E5-2687W v3

Intel Core i7-860

Differences

Reasons to consider the Intel Xeon E5-2687W v3

6 more cores, run more applications at once: 10 vs 4
12 more threads: 20 vs 8
Around 1% higher clock speed: 3.50 GHz vs 3.46 GHz
Around 3% higher maximum core temperature: 74.7°C vs 72.7°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
48x more maximum memory size: 768 GB vs 16 GB
Around 46% better performance in PassMark - Single thread mark: 1942 vs 1331
7.8x better performance in PassMark - CPU mark: 23651 vs 3022
Around 59% better performance in Geekbench 4 - Single Core: 805 vs 507
3.8x better performance in Geekbench 4 - Multi-Core: 7269 vs 1890

Specifications (specs)
Number of cores	10 vs 4
Number of threads	20 vs 8
Maximum frequency	3.50 GHz vs 3.46 GHz
Maximum core temperature	74.7°C vs 72.7°C
Manufacturing process technology	22 nm vs 45 nm
Maximum memory size	768 GB vs 16 GB
Max number of CPUs in a configuration	2 vs 1
Benchmarks
PassMark - Single thread mark	1942 vs 1331
PassMark - CPU mark	23651 vs 3022
Geekbench 4 - Single Core	805 vs 507
Geekbench 4 - Multi-Core	7269 vs 1890

Reasons to consider the Intel Core i7-860

Around 68% lower typical power consumption: 95 Watt vs 160 Watt

Thermal Design Power (TDP)	95 Watt vs 160 Watt

Compare benchmarks

CPU 1: Intel Xeon E5-2687W v3
CPU 2: Intel Core i7-860

PassMark - Single thread mark

CPU 1

CPU 2

1942

1331

PassMark - CPU mark

CPU 1

CPU 2

23651

3022

Geekbench 4 - Single Core

CPU 1

CPU 2

805

507

Geekbench 4 - Multi-Core

CPU 1

CPU 2

7269

1890

Name	Intel Xeon E5-2687W v3	Intel Core i7-860
PassMark - Single thread mark	1942	1331
PassMark - CPU mark	23651	3022
Geekbench 4 - Single Core	805	507
Geekbench 4 - Multi-Core	7269	1890
3DMark Fire Strike - Physics Score		2296
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		0.949
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		49.877
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.312
CompuBench 1.5 Desktop - Video Composition (Frames/s)		1.485
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		4.161

Compare specifications (specs)

	Intel Xeon E5-2687W v3	Intel Core i7-860
Essentials
Architecture codename	Haswell	Lynnfield
Launch date	Q3'14	September 2009
Place in performance rating	1263	2740
Processor Number	E5-2687WV3	i7-860
Series	Intel® Xeon® Processor E5 v3 Family	Legacy Intel® Core™ Processors
Status	Launched	Discontinued
Vertical segment	Server	Desktop
Launch price (MSRP)		$229
Price now		$289.95
Value for money (0-100)		5.09
Performance
64 bit support
Base frequency	3.10 GHz	2.80 GHz
Bus Speed	9.6 GT/s QPI	2.5 GT/s DMI
Manufacturing process technology	22 nm	45 nm
Maximum core temperature	74.7°C	72.7°C
Maximum frequency	3.50 GHz	3.46 GHz
Number of cores	10	4
Number of QPI Links	2
Number of threads	20	8
VID voltage range	0.65V–1.30V	0.6500V-1.4000V
Die size		296 mm2
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		8192 KB (shared)
Transistor count		774 million
Memory
Max memory channels	4	2
Maximum memory bandwidth	68 GB/s	21 GB/s
Maximum memory size	768 GB	16 GB
Supported memory types	DDR4 1600/1866/2133	DDR3 1066/1333
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2	1
Package Size	52.5mm x 45mm	37.5mm x 37.5mm
Sockets supported	FCLGA2011-3	LGA1156
Thermal Design Power (TDP)	160 Watt	95 Watt
Peripherals
Max number of PCIe lanes	40	16
PCI Express revision	3.0	2.0
PCIe configurations	x4, x8, x16	1x16, 2x8
Scalability	2S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX2	Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	46-bit	36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)