Intel Xeon E5-4620 v4 vs Intel Xeon E5-2699R v4
Comparative analysis of Intel Xeon E5-4620 v4 and Intel Xeon E5-2699R v4 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon E5-4620 v4
- Around 38% lower typical power consumption: 105 Watt vs 145 Watt
| Max number of CPUs in a configuration | 4 vs 2 |
| Thermal Design Power (TDP) | 105 Watt vs 145 Watt |
Reasons to consider the Intel Xeon E5-2699R v4
- 12 more cores, run more applications at once: 22 vs 10
- 24 more threads: 44 vs 20
- Around 38% higher clock speed: 3.60 GHz vs 2.60 GHz
| Number of cores | 22 vs 10 |
| Number of threads | 44 vs 20 |
| Maximum frequency | 3.60 GHz vs 2.60 GHz |
Compare specifications (specs)
| Intel Xeon E5-4620 v4 | Intel Xeon E5-2699R v4 | |
|---|---|---|
Essentials |
||
| Architecture codename | Broadwell | Broadwell |
| Launch date | Q2'16 | 04'16 |
| Place in performance rating | not rated | not rated |
| Processor Number | E5-4620V4 | E5-2699RV4 |
| Series | Intel® Xeon® Processor E5 v4 Family | Intel® Xeon® Processor E5 v4 Family |
| Status | Launched | Launched |
| Vertical segment | Server | Embedded |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.10 GHz | 2.20 GHz |
| Bus Speed | 8 GT/s QPI | 9.6 GT/s QPI |
| Manufacturing process technology | 14 nm | 14 nm |
| Maximum core temperature | 79 | |
| Maximum frequency | 2.60 GHz | 3.60 GHz |
| Number of cores | 10 | 22 |
| Number of QPI Links | 2 | 2 |
| Number of threads | 20 | 44 |
| VID voltage range | 0 | |
Memory |
||
| Max memory channels | 4 | 4 |
| Maximum memory bandwidth | 68 GB/s | 76.8 GB/s |
| Maximum memory size | 1.5 TB | 1.5 TB |
| Supported memory types | DDR4 | DDR4 1600/1866/2133/2400 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 4 | 2 |
| Package Size | 45mm x 52.5mm | 45mm x 52.5mm |
| Sockets supported | FCLGA2011-3 | FCLGA2011-3 |
| Thermal Design Power (TDP) | 105 Watt | 145 Watt |
Peripherals |
||
| Max number of PCIe lanes | 40 | 40 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | x4, x8, x16 | x4, x8, x16 |
| Scalability | 4S | 2S |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Intel® Identity Protection technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX2 | Intel® AVX2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® Instruction Replay Technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 46-bit | 46-bit |
| Thermal Monitoring | ||
| Intel® Demand Based Switching | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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