Intel Xeon E7-2870 v2 vs Intel Xeon E7-8867L

Comparative analysis of Intel Xeon E7-2870 v2 and Intel Xeon E7-8867L processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.

 

Differences

Reasons to consider the Intel Xeon E7-2870 v2

  • 5 more cores, run more applications at once: 15 vs 10
  • 10 more threads: 30 vs 20
  • Around 15% higher clock speed: 2.90 GHz vs 2.53 GHz
  • Around 14% higher maximum core temperature: 73°C vs 64°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Number of cores 15 vs 10
Number of threads 30 vs 20
Maximum frequency 2.90 GHz vs 2.53 GHz
Maximum core temperature 73°C vs 64°C
Manufacturing process technology 22 nm vs 32 nm

Reasons to consider the Intel Xeon E7-8867L

  • 2.7x more maximum memory size: 4 TB vs 1.5 TB
  • Around 24% lower typical power consumption: 105 Watt vs 130 Watt
Maximum memory size 4 TB vs 1.5 TB
Max number of CPUs in a configuration 8 vs 2
Thermal Design Power (TDP) 105 Watt vs 130 Watt

Compare specifications (specs)

Intel Xeon E7-2870 v2 Intel Xeon E7-8867L

Essentials

Architecture codename Ivy Bridge Westmere EX
Launch date Q1'14 Q2'11
Place in performance rating not rated not rated
Processor Number E7-2870V2 E7-8867L
Series Intel® Xeon® Processor E7 v2 Family Intel® Xeon® Processor E7 Family
Status Launched Discontinued
Vertical segment Server Server

Performance

64 bit support
Base frequency 2.30 GHz 2.13 GHz
Bus Speed 8 GT/s QPI 6.4 GT/s QPI
Manufacturing process technology 22 nm 32 nm
Maximum core temperature 73°C 64°C
Maximum frequency 2.90 GHz 2.53 GHz
Number of cores 15 10
Number of QPI Links 3
Number of threads 30 20

Memory

Max memory channels 4 4
Maximum memory bandwidth 85 GB/s
Maximum memory size 1.5 TB 4 TB
Supported memory types DDR3 1066/1333/1600 DDR3 800/978/1066/1333 (Max Speed 1066 MHz)

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 8
Package Size 52mm x 45mm 49.17mm x 56.47mm
Sockets supported FCLGA2011 LGA1567
Thermal Design Power (TDP) 130 Watt 105 Watt

Peripherals

Max number of PCIe lanes 32
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability S2S S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Instruction Replay Technology
Intel® TSX-NI
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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