Intel Xeon E7-2870 v2 vs Intel Xeon E7-8867L
Comparative analysis of Intel Xeon E7-2870 v2 and Intel Xeon E7-8867L processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon E7-2870 v2
- 5 more cores, run more applications at once: 15 vs 10
- 10 more threads: 30 vs 20
- Around 15% higher clock speed: 2.90 GHz vs 2.53 GHz
- Around 14% higher maximum core temperature: 73°C vs 64°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Number of cores | 15 vs 10 |
Number of threads | 30 vs 20 |
Maximum frequency | 2.90 GHz vs 2.53 GHz |
Maximum core temperature | 73°C vs 64°C |
Manufacturing process technology | 22 nm vs 32 nm |
Reasons to consider the Intel Xeon E7-8867L
- 2.7x more maximum memory size: 4 TB vs 1.5 TB
- Around 24% lower typical power consumption: 105 Watt vs 130 Watt
Maximum memory size | 4 TB vs 1.5 TB |
Max number of CPUs in a configuration | 8 vs 2 |
Thermal Design Power (TDP) | 105 Watt vs 130 Watt |
Compare specifications (specs)
Intel Xeon E7-2870 v2 | Intel Xeon E7-8867L | |
---|---|---|
Essentials |
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Architecture codename | Ivy Bridge | Westmere EX |
Launch date | Q1'14 | Q2'11 |
Place in performance rating | not rated | not rated |
Processor Number | E7-2870V2 | E7-8867L |
Series | Intel® Xeon® Processor E7 v2 Family | Intel® Xeon® Processor E7 Family |
Status | Launched | Discontinued |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 2.30 GHz | 2.13 GHz |
Bus Speed | 8 GT/s QPI | 6.4 GT/s QPI |
Manufacturing process technology | 22 nm | 32 nm |
Maximum core temperature | 73°C | 64°C |
Maximum frequency | 2.90 GHz | 2.53 GHz |
Number of cores | 15 | 10 |
Number of QPI Links | 3 | |
Number of threads | 30 | 20 |
Memory |
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Max memory channels | 4 | 4 |
Maximum memory bandwidth | 85 GB/s | |
Maximum memory size | 1.5 TB | 4 TB |
Supported memory types | DDR3 1066/1333/1600 | DDR3 800/978/1066/1333 (Max Speed 1066 MHz) |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 8 |
Package Size | 52mm x 45mm | 49.17mm x 56.47mm |
Sockets supported | FCLGA2011 | LGA1567 |
Thermal Design Power (TDP) | 130 Watt | 105 Watt |
Peripherals |
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Max number of PCIe lanes | 32 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | S2S | S8S |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Instruction Replay Technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |