Intel Xeon E7-4809 v4 vs Intel Xeon E7-8893 v3
Comparative analysis of Intel Xeon E7-4809 v4 and Intel Xeon E7-8893 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon E7-4809 v4
- 4 more cores, run more applications at once: 8 vs 4
- 8 more threads: 16 vs 8
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 2x more maximum memory size: 3 TB vs 1.5 TB
- Around 22% lower typical power consumption: 115 Watt vs 140 Watt
Number of cores | 8 vs 4 |
Number of threads | 16 vs 8 |
Manufacturing process technology | 14 nm vs 22 nm |
Maximum memory size | 3 TB vs 1.5 TB |
Thermal Design Power (TDP) | 115 Watt vs 140 Watt |
Reasons to consider the Intel Xeon E7-8893 v3
- Around 9% higher maximum core temperature: 75°C vs 69°C
Maximum core temperature | 75°C vs 69°C |
Max number of CPUs in a configuration | 8 vs 4 |
Compare specifications (specs)
Intel Xeon E7-4809 v4 | Intel Xeon E7-8893 v3 | |
---|---|---|
Essentials |
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Architecture codename | Broadwell | Haswell |
Launch date | Q2'16 | Q2'15 |
Place in performance rating | not rated | not rated |
Processor Number | E7-4809V4 | E7-8893V3 |
Series | Intel® Xeon® Processor E7 v4 Family | Intel® Xeon® Processor E7 v3 Family |
Status | Launched | Launched |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 2.10 GHz | 3.20 GHz |
Bus Speed | 6.4 GT/s QPI | 9.6 GT/s QPI |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 69°C | 75°C |
Number of cores | 8 | 4 |
Number of QPI Links | 3 | 3 |
Number of threads | 16 | 8 |
Maximum frequency | 3.50 GHz | |
Memory |
||
Max memory channels | 4 | 4 |
Maximum memory bandwidth | 85 GB/s | 85 GB/s |
Maximum memory size | 3 TB | 1.5 TB |
Supported memory types | DDR4-1333/1600/1866 DDR3-1066/1333 | DDR4-1333/1600/1866, DDR3-1066/1333/1600 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 4 | 8 |
Package Size | 45mm x 52.5mm | 52mm x 45mm |
Sockets supported | FCLGA2011 | FCLGA2011 |
Thermal Design Power (TDP) | 115 Watt | 140 Watt |
Peripherals |
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Max number of PCIe lanes | 32 | 32 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | x4, x8, x16 | x4, x8, x16 |
Scalability | S4S | S8S |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Instruction Replay Technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 46-bit | 46-bit |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |