Intel Xeon E7-4820 v4 vs Intel Xeon E7-8893 v3

Comparative analysis of Intel Xeon E7-4820 v4 and Intel Xeon E7-8893 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.

 

Differences

Reasons to consider the Intel Xeon E7-4820 v4

  • 6 more cores, run more applications at once: 10 vs 4
  • 12 more threads: 20 vs 8
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
  • 2x more maximum memory size: 3 TB vs 1.5 TB
  • Around 22% lower typical power consumption: 115 Watt vs 140 Watt
Number of cores 10 vs 4
Number of threads 20 vs 8
Manufacturing process technology 14 nm vs 22 nm
Maximum memory size 3 TB vs 1.5 TB
Thermal Design Power (TDP) 115 Watt vs 140 Watt

Reasons to consider the Intel Xeon E7-8893 v3

  • Around 12% higher maximum core temperature: 75°C vs 67°C
Maximum core temperature 75°C vs 67°C
Max number of CPUs in a configuration 8 vs 4

Compare specifications (specs)

Intel Xeon E7-4820 v4 Intel Xeon E7-8893 v3

Essentials

Architecture codename Broadwell Haswell
Launch date Q2'16 Q2'15
Place in performance rating not rated not rated
Processor Number E7-4820V4 E7-8893V3
Series Intel® Xeon® Processor E7 v4 Family Intel® Xeon® Processor E7 v3 Family
Status Launched Launched
Vertical segment Server Server

Performance

64 bit support
Base frequency 2.00 GHz 3.20 GHz
Bus Speed 6.4 GT/s QPI 9.6 GT/s QPI
Manufacturing process technology 14 nm 22 nm
Maximum core temperature 67°C 75°C
Number of cores 10 4
Number of QPI Links 3 3
Number of threads 20 8
Maximum frequency 3.50 GHz

Memory

Max memory channels 4 4
Maximum memory bandwidth 85 GB/s 85 GB/s
Maximum memory size 3 TB 1.5 TB
Supported memory types DDR4-1333/1600/1866, DDR3-1066/1333 DDR4-1333/1600/1866, DDR3-1066/1333/1600

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 4 8
Package Size 45mm x 52.5mm 52mm x 45mm
Sockets supported FCLGA2011 FCLGA2011
Thermal Design Power (TDP) 115 Watt 140 Watt

Peripherals

Max number of PCIe lanes 32 32
PCI Express revision 3.0 3.0
PCIe configurations x4, x8, x16 x4, x8, x16
Scalability S4S S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2 Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Instruction Replay Technology
Intel® TSX-NI
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 46-bit 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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