Intel Xeon E7-8850 v2 vs Intel Xeon E7-8857 v2

Comparative analysis of Intel Xeon E7-8850 v2 and Intel Xeon E7-8857 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon E7-8850 v2

  • 12 more threads: 24 vs 12
  • Around 24% lower typical power consumption: 105 Watt vs 130 Watt
Number of threads 24 vs 12
Thermal Design Power (TDP) 105 Watt vs 130 Watt

Reasons to consider the Intel Xeon E7-8857 v2

  • Around 29% higher clock speed: 3.60 GHz vs 2.80 GHz
  • Around 7% higher maximum core temperature: 73°C vs 68°C
Maximum frequency 3.60 GHz vs 2.80 GHz
Maximum core temperature 73°C vs 68°C

Compare benchmarks

CPU 1: Intel Xeon E7-8850 v2
CPU 2: Intel Xeon E7-8857 v2

Name Intel Xeon E7-8850 v2 Intel Xeon E7-8857 v2
PassMark - Single thread mark 1935
PassMark - CPU mark 36304

Compare specifications (specs)

Intel Xeon E7-8850 v2 Intel Xeon E7-8857 v2

Essentials

Architecture codename Ivy Bridge Ivy Bridge
Launch date Q1'14 Q1'14
Place in performance rating not rated 817
Processor Number E7-8850V2 E7-8857V2
Series Intel® Xeon® Processor E7 v2 Family Intel® Xeon® Processor E7 v2 Family
Status Launched Launched
Vertical segment Server Server

Performance

64 bit support
Base frequency 2.30 GHz 3.00 GHz
Bus Speed 7.2 GT/s QPI 8 GT/s QPI
Manufacturing process technology 22 nm 22 nm
Maximum core temperature 68°C 73°C
Maximum frequency 2.80 GHz 3.60 GHz
Number of cores 12 12
Number of QPI Links 3 3
Number of threads 24 12

Memory

Max memory channels 4 4
Maximum memory bandwidth 68 GB/s 85 GB/s
Maximum memory size 1.5 TB 1.5 TB
Supported memory types DDR3 1066/1333/1600 DDR3 1066/1333/1600

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 8 8
Package Size 52mm x 45mm 52mm x 45mm
Sockets supported FCLGA2011 FCLGA2011
Thermal Design Power (TDP) 105 Watt 130 Watt

Peripherals

Max number of PCIe lanes 32 32
PCI Express revision 3.0 3.0
PCIe configurations x4, x8, x16 x4, x8, x16
Scalability S8S S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Instruction Replay Technology
Intel® TSX-NI
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 46-bit 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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