Intel Xeon E7-8893 v2 vs Intel Xeon E7-4870 v2
Comparative analysis of Intel Xeon E7-8893 v2 and Intel Xeon E7-4870 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon E7-8893 v2
- Around 28% higher clock speed: 3.70 GHz vs 2.90 GHz
- Around 5% higher maximum core temperature: 77°C vs 73°C
Maximum frequency | 3.70 GHz vs 2.90 GHz |
Maximum core temperature | 77°C vs 73°C |
Max number of CPUs in a configuration | 8 vs 4 |
Reasons to consider the Intel Xeon E7-4870 v2
- 9 more cores, run more applications at once: 15 vs 6
- 18 more threads: 30 vs 12
- Around 19% lower typical power consumption: 130 Watt vs 155 Watt
Number of cores | 15 vs 6 |
Number of threads | 30 vs 12 |
Thermal Design Power (TDP) | 130 Watt vs 155 Watt |
Compare specifications (specs)
Intel Xeon E7-8893 v2 | Intel Xeon E7-4870 v2 | |
---|---|---|
Essentials |
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Architecture codename | Ivy Bridge | Ivy Bridge |
Launch date | Q1'14 | Q1'14 |
Place in performance rating | not rated | not rated |
Processor Number | E7-8893V2 | E7-4870V2 |
Series | Intel® Xeon® Processor E7 v2 Family | Intel® Xeon® Processor E7 v2 Family |
Status | Launched | Launched |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 3.40 GHz | 2.30 GHz |
Bus Speed | 8 GT/s QPI | 8 GT/s QPI |
Manufacturing process technology | 22 nm | 22 nm |
Maximum core temperature | 77°C | 73°C |
Maximum frequency | 3.70 GHz | 2.90 GHz |
Number of cores | 6 | 15 |
Number of QPI Links | 3 | 3 |
Number of threads | 12 | 30 |
Memory |
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Max memory channels | 4 | 4 |
Maximum memory bandwidth | 85 GB/s | 85 GB/s |
Maximum memory size | 1.5 TB | 1.5 TB |
Supported memory types | DDR3 1066/1333/1600 | DDR3 1066/1333/1600 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 8 | 4 |
Package Size | 52mm x 45mm | 52mm x 45mm |
Sockets supported | FCLGA2011 | FCLGA2011 |
Thermal Design Power (TDP) | 155 Watt | 130 Watt |
Peripherals |
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Max number of PCIe lanes | 32 | 32 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | x4, x8, x16 | x4, x8, x16 |
Scalability | S8S | S4S |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | Intel® AVX |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Instruction Replay Technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 46-bit | 46-bit |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |