Intel Xeon E7330 vs AMD Opteron 6128 HE
Comparative analysis of Intel Xeon E7330 and AMD Opteron 6128 HE processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon E7330
- Around 20% higher maximum core temperature: 66°C vs 55°C
- Around 6% lower typical power consumption: 80 Watt vs 85 Watt
- Around 6% better performance in PassMark - Single thread mark: 933 vs 883
- Around 7% better performance in PassMark - CPU mark: 6792 vs 6339
Specifications (specs) | |
Maximum core temperature | 66°C vs 55°C |
Thermal Design Power (TDP) | 80 Watt vs 85 Watt |
Benchmarks | |
PassMark - Single thread mark | 933 vs 883 |
PassMark - CPU mark | 6792 vs 6339 |
Reasons to consider the AMD Opteron 6128 HE
- 4 more cores, run more applications at once: 8 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 2097152x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores | 8 vs 4 |
Manufacturing process technology | 45 nm vs 65 nm |
L3 cache | 12 MB vs 6 MB L2 Cache |
Compare benchmarks
CPU 1: Intel Xeon E7330
CPU 2: AMD Opteron 6128 HE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E7330 | AMD Opteron 6128 HE |
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PassMark - Single thread mark | 933 | 883 |
PassMark - CPU mark | 6792 | 6339 |
Compare specifications (specs)
Intel Xeon E7330 | AMD Opteron 6128 HE | |
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Essentials |
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Architecture codename | Tigerton | Maranello |
Launch date | Q3'07 | 29 Mar 2010 |
Place in performance rating | 2169 | 2235 |
Processor Number | E7330 | |
Series | Legacy Intel Xeon Processors | AMD Opteron 6100 series |
Vertical segment | Server | Server |
Family | AMD Opteron | |
Launch price (MSRP) | $523 | |
OPN Tray | OS6128VAT8EGO | |
Performance |
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64 bit support | ||
Base frequency | 2.40 GHz | 2.0 GHz |
Bus Speed | 1066 MHz | |
Die size | 286 mm2 | 346 mm |
L3 cache | 6 MB L2 Cache | 12 MB |
Manufacturing process technology | 65 nm | 45 nm |
Maximum core temperature | 66°C | 55°C |
Number of cores | 4 | 8 |
Transistor count | 582 million | 1808 million |
VID voltage range | 1.0V-1.5V | |
L1 cache | 1 MB | |
L2 cache | 4 MB | |
Maximum case temperature (TCase) | 66 °C | |
Maximum frequency | 3.2 GHz | |
Number of threads | 8 | |
Unlocked | ||
Compatibility |
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Package Size | 53.3mm x 53.3mm | |
Sockets supported | PGA604, PPGA604 | G34 |
Thermal Design Power (TDP) | 80 Watt | 85 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Fused Multiply-Add (FMA) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
AMD Virtualization (AMD-V™) | ||
Memory |
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Max memory channels | 4 | |
Maximum memory bandwidth | 42.7 GB/s | |
Supported memory types | DDR2-1066, DDR3-1333, LV DDR3-1066 |