Intel Xeon E7530 vs Intel Xeon X5690
Comparative analysis of Intel Xeon E7530 and Intel Xeon X5690 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E7530
- Around 24% lower typical power consumption: 105 Watt vs 130 Watt
| Thermal Design Power (TDP) | 105 Watt vs 130 Watt |
Reasons to consider the Intel Xeon X5690
- Around 75% higher clock speed: 3.73 GHz vs 2.13 GHz
- Around 23% higher maximum core temperature: 78.5°C vs 64°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 93% better performance in PassMark - Single thread mark: 1713 vs 887
- Around 79% better performance in PassMark - CPU mark: 12914 vs 7231
| Specifications (specs) | |
| Maximum frequency | 3.73 GHz vs 2.13 GHz |
| Maximum core temperature | 78.5°C vs 64°C |
| Manufacturing process technology | 32 nm vs 45 nm |
| L3 cache | 12288 KB (shared) vs 12 MB L3 Cache |
| Benchmarks | |
| PassMark - Single thread mark | 1713 vs 887 |
| PassMark - CPU mark | 12914 vs 7231 |
Compare benchmarks
CPU 1: Intel Xeon E7530
CPU 2: Intel Xeon X5690
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Xeon E7530 | Intel Xeon X5690 |
|---|---|---|
| PassMark - Single thread mark | 887 | 1713 |
| PassMark - CPU mark | 7231 | 12914 |
| Geekbench 4 - Single Core | 637 | |
| Geekbench 4 - Multi-Core | 3517 | |
| 3DMark Fire Strike - Physics Score | 0 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.301 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 57.148 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.762 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.122 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 15.77 |
Compare specifications (specs)
| Intel Xeon E7530 | Intel Xeon X5690 | |
|---|---|---|
Essentials |
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| Architecture codename | Nehalem EX | Westmere EP |
| Launch date | Q1'10 | February 2011 |
| Place in performance rating | 2239 | 2267 |
| Processor Number | E7530 | X5690 |
| Series | Legacy Intel Xeon Processors | Legacy Intel® Xeon® Processors |
| Vertical segment | Server | Server |
| Launch price (MSRP) | $205 | |
| Price now | $149 | |
| Status | Discontinued | |
| Value for money (0-100) | 17.68 | |
Performance |
||
| Base frequency | 1.87 GHz | 3.46 GHz |
| Bus Speed | 5.86 GT/s | 6.4 GT/s QPI |
| L3 cache | 12 MB L3 Cache | 12288 KB (shared) |
| Manufacturing process technology | 45 nm | 32 nm |
| Maximum core temperature | 64°C | 78.5°C |
| Maximum frequency | 2.13 GHz | 3.73 GHz |
| Number of cores | 6 | 6 |
| Number of threads | 12 | 12 |
| 64 bit support | ||
| Die size | 239 mm | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| Number of QPI Links | 2 | |
| Transistor count | 1170 million | |
| VID voltage range | 0.750V-1.350V | |
Compatibility |
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| Sockets supported | FCLGA1567 | FCLGA1366 |
| Thermal Design Power (TDP) | 105 Watt | 130 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 2 | |
| Package Size | 42.5mm X 45mm | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.2 | |
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Physical Address Extensions (PAE) | 40-bit | |
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
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| ECC memory support | ||
| Max memory channels | 3 | |
| Maximum memory bandwidth | 32 GB/s | |
| Maximum memory size | 288 GB | |
| Supported memory types | DDR3 800/1066/1333 | |
