Intel Xeon Gold 6256 vs Intel Xeon E5-2651 v2

Comparative analysis of Intel Xeon Gold 6256 and Intel Xeon E5-2651 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon Gold 6256

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
  • Around 10% more L3 cache; more data can be stored in the L3 cache for quick access later
  • 1365.3x more maximum memory size: 1 TB vs 768 GB (per socket)
Manufacturing process technology 14 nm vs 22 nm
L3 cache 33 MB vs 30 MB
Maximum memory size 1 TB vs 768 GB (per socket)

Compare benchmarks

CPU 1: Intel Xeon Gold 6256
CPU 2: Intel Xeon E5-2651 v2

Name Intel Xeon Gold 6256 Intel Xeon E5-2651 v2
PassMark - Single thread mark 2634
PassMark - CPU mark 46766
Geekbench 4 - Single Core 2030
Geekbench 4 - Multi-Core 18071

Compare specifications (specs)

Intel Xeon Gold 6256 Intel Xeon E5-2651 v2

Essentials

Architecture codename Cascade Lake Ivy Bridge-EP
Launch date Q1'20 November 2013
Launch price (MSRP) $4466
Place in performance rating 308 287
Processor Number 6256 E5-2651 v2
Series 2nd Generation Intel Xeon Scalable Processors
Vertical segment Server Server
Family Intel Xeon E5-2600 v2

Performance

Base frequency 3.60 GHz 1800 MHz
L3 cache 33 MB 30 MB
Manufacturing process technology 14 nm 22 nm
Maximum core temperature 64°C
Maximum frequency 4.50 GHz
Number of cores 12 12
Number of threads 24 24
64 bit support
Bus Speed 5 GT/s DMI
L1 cache 768 KB
L2 cache 3 MB

Memory

Max memory channels 6 4
Maximum memory size 1 TB 768 GB (per socket)
Supported memory frequency 2933 MHz
Supported memory types DDR4-2933 DDR3
ECC memory support

Compatibility

Package Size 76.0mm x 56.5mm
Sockets supported FCLGA3647 LGA2011
Thermal Design Power (TDP) 205 Watt
Max number of CPUs in a configuration 2

Peripherals

Max number of PCIe lanes 48
PCI Express revision 3.0 3.0
Scalability S4S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units 2
Speed Shift technology
Intel® Advanced Vector Extensions (AVX)

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)