Intel Xeon Gold 6326 vs Intel Xeon 5120
Comparative analysis of Intel Xeon Gold 6326 and Intel Xeon 5120 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Xeon Gold 6326
- CPU is newer: launch date 14 year(s) 10 month(s) later
- 14 more cores, run more applications at once: 16 vs 2
- Around 88% higher clock speed: 3.50 GHz vs 1.86 GHz
- Around 20% higher maximum core temperature: 78°C vs 65°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 65 nm
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 3.1x better performance in PassMark - Single thread mark: 2350 vs 770
- 35.9x better performance in PassMark - CPU mark: 53385 vs 1486
| Specifications (specs) | |
| Launch date | 6 Apr 2021 vs June 2006 |
| Number of cores | 16 vs 2 |
| Maximum frequency | 3.50 GHz vs 1.86 GHz |
| Maximum core temperature | 78°C vs 65°C |
| Manufacturing process technology | 10 nm vs 65 nm |
| L2 cache | 16 MB vs 4096 KB |
| Benchmarks | |
| PassMark - Single thread mark | 2350 vs 770 |
| PassMark - CPU mark | 53385 vs 1486 |
Reasons to consider the Intel Xeon 5120
- 2.8x lower typical power consumption: 65 Watt vs 185 Watt
| Thermal Design Power (TDP) | 65 Watt vs 185 Watt |
Compare benchmarks
CPU 1: Intel Xeon Gold 6326
CPU 2: Intel Xeon 5120
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Xeon Gold 6326 | Intel Xeon 5120 |
|---|---|---|
| PassMark - Single thread mark | 2350 | 770 |
| PassMark - CPU mark | 53385 | 1486 |
| Geekbench 4 - Single Core | 3655 | |
| Geekbench 4 - Multi-Core | 25615 |
Compare specifications (specs)
| Intel Xeon Gold 6326 | Intel Xeon 5120 | |
|---|---|---|
Essentials |
||
| Architecture codename | Ice Lake | Woodcrest |
| Launch date | 6 Apr 2021 | June 2006 |
| Launch price (MSRP) | $1517 | $45 |
| Place in performance rating | 476 | 473 |
| Processor Number | 6326 | 5120 |
| Series | 3rd Generation Intel Xeon Scalable Processors | Legacy Intel® Xeon® Processors |
| Vertical segment | Server | Server |
| Price now | $1,628.48 | |
| Status | Discontinued | |
| Value for money (0-100) | 0.23 | |
Performance |
||
| Base frequency | 2.90 GHz | 1.86 GHz |
| L1 cache | 1 MB | |
| L2 cache | 16 MB | 4096 KB |
| L3 cache | 24 MB | |
| Manufacturing process technology | 10 nm | 65 nm |
| Maximum core temperature | 78°C | 65°C |
| Maximum frequency | 3.50 GHz | 1.86 GHz |
| Number of cores | 16 | 2 |
| Number of threads | 32 | |
| 64 bit support | ||
| Bus Speed | 1066 MHz FSB | |
| Die size | 143 mm2 | |
| Transistor count | 291 million | |
| VID voltage range | B2=1.0V-1.5V, G0=.85V-1.5V | |
Memory |
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| Max memory channels | 8 | |
| Maximum memory size | 6 TB | |
| Supported memory frequency | 3200 MHz | |
| Supported memory types | DDR4-3200 | DDR2 |
Compatibility |
||
| Package Size | 77.5mm x 56.5mm | 37.5mm x 37.5mm |
| Sockets supported | FCLGA4189 | LGA771 |
| Thermal Design Power (TDP) | 185 Watt | 65 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Scenario Design Power (SDP) | 0 W | |
Peripherals |
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| Max number of PCIe lanes | 64 | |
| PCI Express revision | 4.0 | |
| Scalability | 2S | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Run Sure Technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Number of AVX-512 FMA Units | 2 | |
| Speed Shift technology | ||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel® Demand Based Switching | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
