Intel Xeon Gold 6346 vs Intel Xeon W-1370
Comparative analysis of Intel Xeon Gold 6346 and Intel Xeon W-1370 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Gold 6346
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
- Around 60% more L1 cache; more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.3x more L3 cache, more data can be stored in the L3 cache for quick access later
- 48x more maximum memory size: 6 TB vs 128 GB
- 2.4x better performance in PassMark - CPU mark: 55568 vs 22926
| Specifications (specs) | |
| Manufacturing process technology | 10 nm vs 14 nm |
| L1 cache | 1 MB vs 640 KB |
| L2 cache | 16 MB vs 4 MB |
| L3 cache | 36 MB vs 16 MB |
| Maximum memory size | 6 TB vs 128 GB |
| Benchmarks | |
| PassMark - CPU mark | 55568 vs 22926 |
Reasons to consider the Intel Xeon W-1370
- CPU is newer: launch date 1 month(s) later
- Around 42% higher clock speed: 5.10 GHz vs 3.60 GHz
- Around 28% higher maximum core temperature: 100°C vs 78°C
- 2.6x lower typical power consumption: 80 Watt vs 205 Watt
- Around 41% better performance in PassMark - Single thread mark: 3478 vs 2461
| Specifications (specs) | |
| Launch date | 6 May 2021 vs 6 Apr 2021 |
| Maximum frequency | 5.10 GHz vs 3.60 GHz |
| Maximum core temperature | 100°C vs 78°C |
| Thermal Design Power (TDP) | 80 Watt vs 205 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 3478 vs 2461 |
Compare benchmarks
CPU 1: Intel Xeon Gold 6346
CPU 2: Intel Xeon W-1370
| PassMark - Single thread mark |
|
|
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| PassMark - CPU mark |
|
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| Name | Intel Xeon Gold 6346 | Intel Xeon W-1370 |
|---|---|---|
| PassMark - Single thread mark | 2461 | 3478 |
| PassMark - CPU mark | 55568 | 22926 |
Compare specifications (specs)
| Intel Xeon Gold 6346 | Intel Xeon W-1370 | |
|---|---|---|
Essentials |
||
| Architecture codename | Ice Lake | Rocket Lake |
| Launch date | 6 Apr 2021 | 6 May 2021 |
| Launch price (MSRP) | $2708 | $362 - $365 |
| Place in performance rating | 351 | 347 |
| Processor Number | 6346 | W-1370 |
| Series | 3rd Generation Intel Xeon Scalable Processors | Intel Xeon W Processor |
| Vertical segment | Server | Workstation |
| Status | Launched | |
Performance |
||
| Base frequency | 3.10 GHz | 2.90 GHz |
| L1 cache | 1 MB | 640 KB |
| L2 cache | 16 MB | 4 MB |
| L3 cache | 36 MB | 16 MB |
| Manufacturing process technology | 10 nm | 14 nm |
| Maximum core temperature | 78°C | 100°C |
| Maximum frequency | 3.60 GHz | 5.10 GHz |
| Number of cores | 16 | |
| Number of threads | 32 | |
| 64 bit support | ||
| Bus Speed | 8 GT/s | |
Memory |
||
| Max memory channels | 8 | 2 |
| Maximum memory size | 6 TB | 128 GB |
| Supported memory frequency | 3200 MHz | |
| Supported memory types | DDR4-3200 | DDR4-3200 |
| Maximum memory bandwidth | 50 GB/s | |
Compatibility |
||
| Package Size | 77.5mm x 56.5mm | 37.5 mm x 37.5 mm |
| Sockets supported | FCLGA4189 | FCLGA1200 |
| Thermal Design Power (TDP) | 205 Watt | 80 Watt |
| Max number of CPUs in a configuration | 1 | |
| Thermal Solution | PCG 2019B | |
Peripherals |
||
| Max number of PCIe lanes | 64 | 20 |
| PCI Express revision | 4.0 | 4.0 |
| Scalability | 2S | 1S Only |
| PCIe configurations | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Run Sure Technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Secure Boot | ||
Advanced Technologies |
||
| Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Number of AVX-512 FMA Units | 2 | |
| Speed Shift technology | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Thermal Velocity Boost | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
||
| Device ID | 0x4C90 | |
| Execution Units | 32 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.30 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel UHD Graphics P750 | |
Graphics interfaces |
||
| Number of displays supported | 3 | |
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 5120 x 3200 @60Hz | |
| Max resolution over eDP | 5120 x 3200 @60Hz | |
Graphics API support |
||
| DirectX | 12.1 | |
| OpenGL | 4.5 | |
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