Intel Xeon Gold 6530 vs AMD EPYC 7573X

Comparative analysis of Intel Xeon Gold 6530 and AMD EPYC 7573X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon Gold 6530

  • CPU is newer: launch date 1 year(s) 8 month(s) later
  • Around 11% higher clock speed: 4 GHz vs 3.6 GHz
  • Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 4% lower typical power consumption: 270 Watt vs 280 Watt
  • Around 11% better performance in PassMark - Single thread mark: 2935 vs 2650
Specifications (specs)
Launch date 14 Dec 2023 vs 22 Mar 2022
Maximum frequency 4 GHz vs 3.6 GHz
L1 cache 80 KB (per core) vs 2 MB
L2 cache 2 MB (per core) vs 16 MB
Max number of CPUs in a configuration 2 vs 1
Thermal Design Power (TDP) 270 Watt vs 280 Watt
Benchmarks
PassMark - Single thread mark 2935 vs 2650

Reasons to consider the AMD EPYC 7573X

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 10 nm
  • 4.8x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 11% better performance in PassMark - CPU mark: 103531 vs 93262
Specifications (specs)
Manufacturing process technology 7 nm vs 10 nm
L3 cache 768 MB vs 160 MB (shared)
Benchmarks
PassMark - CPU mark 103531 vs 93262

Compare benchmarks

CPU 1: Intel Xeon Gold 6530
CPU 2: AMD EPYC 7573X

PassMark - Single thread mark
CPU 1
CPU 2
2935
2650
PassMark - CPU mark
CPU 1
CPU 2
93262
103531
Name Intel Xeon Gold 6530 AMD EPYC 7573X
PassMark - Single thread mark 2935 2650
PassMark - CPU mark 93262 103531

Compare specifications (specs)

Intel Xeon Gold 6530 AMD EPYC 7573X

Essentials

Launch date 14 Dec 2023 22 Mar 2022
Launch price (MSRP) $2128 $5590
Place in performance rating 65 60
Architecture codename Zen 3

Performance

Base frequency 2.1 GHz 2.8 GHz
Die size 2x 763 mm² 81 mm²
L1 cache 80 KB (per core) 2 MB
L2 cache 2 MB (per core) 16 MB
L3 cache 160 MB (shared) 768 MB
Manufacturing process technology 10 nm 7 nm
Maximum case temperature (TCase) 74°C
Maximum core temperature 91°C
Maximum frequency 4 GHz 3.6 GHz
Number of cores 32 32
Number of threads 64 64
Unlocked
Transistor count 33200 million

Memory

ECC memory support
Supported memory types DDR5 DDR4-3200
Max memory channels 8

Compatibility

Max number of CPUs in a configuration 2 1
Sockets supported 4677 SP3
Thermal Design Power (TDP) 270 Watt 280 Watt
Configurable TDP 225-280 Watt

Peripherals

PCIe configurations Gen 5, 80 Lanes, (CPU only)
Max number of PCIe lanes 128
PCI Express revision 4.0