Intel Xeon Gold 6530 vs AMD EPYC 7573X
Comparative analysis of Intel Xeon Gold 6530 and AMD EPYC 7573X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Gold 6530
- CPU is newer: launch date 1 year(s) 8 month(s) later
- Around 11% higher clock speed: 4 GHz vs 3.6 GHz
- Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 4% lower typical power consumption: 270 Watt vs 280 Watt
- Around 11% better performance in PassMark - Single thread mark: 2935 vs 2650
Specifications (specs) | |
Launch date | 14 Dec 2023 vs 22 Mar 2022 |
Maximum frequency | 4 GHz vs 3.6 GHz |
L1 cache | 80 KB (per core) vs 2 MB |
L2 cache | 2 MB (per core) vs 16 MB |
Max number of CPUs in a configuration | 2 vs 1 |
Thermal Design Power (TDP) | 270 Watt vs 280 Watt |
Benchmarks | |
PassMark - Single thread mark | 2935 vs 2650 |
Reasons to consider the AMD EPYC 7573X
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 10 nm
- 4.8x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 11% better performance in PassMark - CPU mark: 103531 vs 93262
Specifications (specs) | |
Manufacturing process technology | 7 nm vs 10 nm |
L3 cache | 768 MB vs 160 MB (shared) |
Benchmarks | |
PassMark - CPU mark | 103531 vs 93262 |
Compare benchmarks
CPU 1: Intel Xeon Gold 6530
CPU 2: AMD EPYC 7573X
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon Gold 6530 | AMD EPYC 7573X |
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PassMark - Single thread mark | 2935 | 2650 |
PassMark - CPU mark | 93262 | 103531 |
Compare specifications (specs)
Intel Xeon Gold 6530 | AMD EPYC 7573X | |
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Essentials |
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Launch date | 14 Dec 2023 | 22 Mar 2022 |
Launch price (MSRP) | $2128 | $5590 |
Place in performance rating | 65 | 60 |
Architecture codename | Zen 3 | |
Performance |
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Base frequency | 2.1 GHz | 2.8 GHz |
Die size | 2x 763 mm² | 81 mm² |
L1 cache | 80 KB (per core) | 2 MB |
L2 cache | 2 MB (per core) | 16 MB |
L3 cache | 160 MB (shared) | 768 MB |
Manufacturing process technology | 10 nm | 7 nm |
Maximum case temperature (TCase) | 74°C | |
Maximum core temperature | 91°C | |
Maximum frequency | 4 GHz | 3.6 GHz |
Number of cores | 32 | 32 |
Number of threads | 64 | 64 |
Unlocked | ||
Transistor count | 33200 million | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR4-3200 |
Max memory channels | 8 | |
Compatibility |
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Max number of CPUs in a configuration | 2 | 1 |
Sockets supported | 4677 | SP3 |
Thermal Design Power (TDP) | 270 Watt | 280 Watt |
Configurable TDP | 225-280 Watt | |
Peripherals |
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PCIe configurations | Gen 5, 80 Lanes, (CPU only) | |
Max number of PCIe lanes | 128 | |
PCI Express revision | 4.0 |