Intel Xeon Gold 6530 vs AMD EPYC 75F3
Comparative analysis of Intel Xeon Gold 6530 and AMD EPYC 75F3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Gold 6530
- CPU is newer: launch date 2 year(s) 8 month(s) later
- Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 7% better performance in PassMark - Single thread mark: 2852 vs 2664
| Specifications (specs) | |
| Launch date | 14 Dec 2023 vs 15 Mar 2021 |
| L1 cache | 80 KB (per core) vs 2 MB |
| L2 cache | 2 MB (per core) vs 16 MB |
| Benchmarks | |
| PassMark - Single thread mark | 2852 vs 2664 |
Reasons to consider the AMD EPYC 75F3
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 10 nm
- Around 60% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 20% lower typical power consumption: 225 Watt vs 270 Watt
- Around 10% better performance in PassMark - CPU mark: 101429 vs 92292
| Specifications (specs) | |
| Manufacturing process technology | 7 nm vs 10 nm |
| L3 cache | 256 MB vs 160 MB (shared) |
| Thermal Design Power (TDP) | 225 Watt vs 270 Watt |
| Benchmarks | |
| PassMark - CPU mark | 101429 vs 92292 |
Compare benchmarks
CPU 1: Intel Xeon Gold 6530
CPU 2: AMD EPYC 75F3
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Xeon Gold 6530 | AMD EPYC 75F3 |
|---|---|---|
| PassMark - Single thread mark | 2852 | 2664 |
| PassMark - CPU mark | 92292 | 101429 |
Compare specifications (specs)
| Intel Xeon Gold 6530 | AMD EPYC 75F3 | |
|---|---|---|
Essentials |
||
| Launch date | 14 Dec 2023 | 15 Mar 2021 |
| Launch price (MSRP) | $2128 | $4860 |
| Place in performance rating | 98 | 93 |
| Architecture codename | Zen 3 | |
| OPN PIB | 100-100000313WOF | |
| OPN Tray | 100-000000313 | |
| Vertical segment | Server | |
Performance |
||
| Base frequency | 2.1 GHz | 2.95 GHz |
| Die size | 2x 763 mm² | |
| L1 cache | 80 KB (per core) | 2 MB |
| L2 cache | 2 MB (per core) | 16 MB |
| L3 cache | 160 MB (shared) | 256 MB |
| Manufacturing process technology | 10 nm | 7 nm |
| Maximum case temperature (TCase) | 74°C | |
| Maximum core temperature | 91°C | |
| Maximum frequency | 4 GHz | 4.0 GHz |
| Number of cores | 32 | 32 |
| Number of threads | 64 | 64 |
| Unlocked | ||
Memory |
||
| ECC memory support | ||
| Supported memory types | DDR5 | DDR4-3200 |
| Max memory channels | 8 | |
| Maximum memory bandwidth | 190.73 GB/s | |
| Maximum memory size | 4 TB | |
Compatibility |
||
| Max number of CPUs in a configuration | 2 | |
| Sockets supported | 4677 | SP3 |
| Thermal Design Power (TDP) | 270 Watt | 225 Watt |
| Configurable TDP | 225-280 Watt | |
| Socket Count | 2P | |
Peripherals |
||
| PCIe configurations | Gen 5, 80 Lanes, (CPU only) | |
| Max number of PCIe lanes | 128 | |
| PCI Express revision | 4.0 | |
Advanced Technologies |
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| AMD SenseMI | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||