Intel Xeon L5518 vs Intel Xeon W3505
Comparative analysis of Intel Xeon L5518 and Intel Xeon W3505 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon L5518
- 2 more cores, run more applications at once: 4 vs 2
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.2x lower typical power consumption: 60 Watt vs 130 Watt
Number of cores | 4 vs 2 |
L1 cache | 64 KB (per core) vs 64 KB (per core) |
L2 cache | 256 KB (per core) vs 256 KB (per core) |
L3 cache | 8192 KB (shared) vs 4096 KB (shared) |
Max number of CPUs in a configuration | 2 vs 1 |
Thermal Design Power (TDP) | 60 Watt vs 130 Watt |
Reasons to consider the Intel Xeon W3505
- Around 5% higher clock speed: 2.53 GHz vs 2.40 GHz
Maximum frequency | 2.53 GHz vs 2.40 GHz |
Compare benchmarks
CPU 1: Intel Xeon L5518
CPU 2: Intel Xeon W3505
Name | Intel Xeon L5518 | Intel Xeon W3505 |
---|---|---|
PassMark - Single thread mark | 1106 | |
PassMark - CPU mark | 1161 |
Compare specifications (specs)
Intel Xeon L5518 | Intel Xeon W3505 | |
---|---|---|
Essentials |
||
Architecture codename | Nehalem EP | Bloomfield |
Launch date | March 2009 | March 2009 |
Place in performance rating | not rated | 2175 |
Processor Number | L5518 | |
Series | Legacy Intel® Xeon® Processors | |
Status | Launched | |
Vertical segment | Embedded | Server |
Performance |
||
64 bit support | ||
Base frequency | 2.13 GHz | |
Bus Speed | 5.86 GT/s QPI | |
Die size | 263 mm2 | 263 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 8192 KB (shared) | 4096 KB (shared) |
Manufacturing process technology | 45 nm | 45 nm |
Maximum core temperature | 85°C | |
Maximum frequency | 2.40 GHz | 2.53 GHz |
Number of cores | 4 | 2 |
Number of QPI Links | 2 | |
Number of threads | 8 | |
Transistor count | 731 million | 731 million |
VID voltage range | 0.75V -1.35V | |
Memory |
||
ECC memory support | ||
Max memory channels | 3 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 144 GB | |
Supported memory types | DDR3 800/1066 | DDR3 |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 1 |
Package Size | 42.5mm x 45mm | |
Sockets supported | FCLGA1366 | 1366 |
Thermal Design Power (TDP) | 60 Watt | 130 Watt |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 40-bit | |
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |