Intel Xeon Phi 7235 vs Intel Xeon Phi 7295

Comparative analysis of Intel Xeon Phi 7235 and Intel Xeon Phi 7295 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.

Intel Xeon Phi 7235

Intel Xeon Phi 7295

Differences

Reasons to consider the Intel Xeon Phi 7235

Around 28% lower typical power consumption: 250 Watt vs 320 Watt

Thermal Design Power (TDP)	250 Watt vs 320 Watt

Reasons to consider the Intel Xeon Phi 7295

8 more cores, run more applications at once: 72 vs 64
Around 14% higher clock speed: 1.60 GHz vs 1.40 GHz
Around 7% higher maximum core temperature: 77°C vs 72°C
Around 13% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 13% more L2 cache; more data can be stored in the L2 cache for quick access later

Number of cores	72 vs 64
Maximum frequency	1.60 GHz vs 1.40 GHz
Maximum core temperature	77°C vs 72°C
L1 cache	32 KB (per core) vs 32 KB (per core)
L2 cache	512 KB (per core) vs 512 KB (per core)

Compare specifications (specs)

	Intel Xeon Phi 7235	Intel Xeon Phi 7295
Essentials
Architecture codename	Knights Mill	Knights Mill
Launch date	December 2017	December 2017
Place in performance rating	not rated	not rated
Processor Number	7235	7295
Series	Intel® Xeon Phi™ 72x5 Processor Family	Intel® Xeon Phi™ 72x5 Processor Family
Status	Launched	Launched
Vertical segment	Server	Server
Performance
64 bit support
Base frequency	1.30 GHz	1.50 GHz
L1 cache	32 KB (per core)	32 KB (per core)
L2 cache	512 KB (per core)	512 KB (per core)
Manufacturing process technology	14 nm	14 nm
Maximum core temperature	72°C	77°C
Maximum frequency	1.40 GHz	1.60 GHz
Number of cores	64	72
Transistor count	8000 million	8000 million
VID voltage range	0.550-1.200V	0.550-1.200V
Memory
Max memory channels	6	6
Maximum memory bandwidth	102 GB/s	115.2 GB/s
Maximum memory size	384 GB	384 GB
Supported memory types	DDR4-2133	DDR4-2400
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Sockets supported	SVLCLGA3647	SVLCLGA3647
Thermal Design Power (TDP)	250 Watt	320 Watt
Peripherals
Max number of PCIe lanes	36	36
PCI Express revision	3.0	3.0
PCIe configurations	x 16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port 1) may negotiate down to x2, or x1	x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port 1) may negotiate down to x2, or x1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Idle States
Instruction set extensions	Intel® AVX-512	Intel® AVX-512
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)