Intel Xeon Phi 7250F vs Intel Xeon Phi 7290F
Comparative analysis of Intel Xeon Phi 7250F and Intel Xeon Phi 7290F processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon Phi 7250F
- Around 13% lower typical power consumption: 230 Watt vs 260 Watt
Thermal Design Power (TDP) | 230 Watt vs 260 Watt |
Reasons to consider the Intel Xeon Phi 7290F
- 4 more cores, run more applications at once: 72 vs 68
- Around 6% higher clock speed: 1.70 GHz vs 1.60 GHz
- Around 6% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 6% more L2 cache; more data can be stored in the L2 cache for quick access later
Number of cores | 72 vs 68 |
Maximum frequency | 1.70 GHz vs 1.60 GHz |
L1 cache | 32 KB (per core) vs 32 KB (per core) |
L2 cache | 512 KB (per core) vs 512 KB (per core) |
Compare specifications (specs)
Intel Xeon Phi 7250F | Intel Xeon Phi 7290F | |
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Essentials |
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Architecture codename | Knights Landing | Knights Landing |
Launch date | June 2016 | June 2016 |
Place in performance rating | not rated | not rated |
Processor Number | 7250F | 7290F |
Series | Intel® Xeon Phi™ x200 Product Family | Intel® Xeon Phi™ x200 Product Family |
Status | Launched | Launched |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 1.40 GHz | 1.50 GHz |
L1 cache | 32 KB (per core) | 32 KB (per core) |
L2 cache | 512 KB (per core) | 512 KB (per core) |
Manufacturing process technology | 14 nm | 14 nm |
Maximum frequency | 1.60 GHz | 1.70 GHz |
Number of cores | 68 | 72 |
Transistor count | 8000 million | 8000 million |
VID voltage range | 0.550-1.125V | 0.550-1.125V |
Memory |
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ECC memory support | ||
Max memory channels | 6 | 6 |
Maximum memory bandwidth | 115.2 GB/s | 115.2 GB/s |
Maximum memory size | 384 GB | 384 GB |
Supported memory types | DDR4-2400 | DDR4-2400 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | SVLCLGA3647 | SVLCLGA3647 |
Thermal Design Power (TDP) | 230 Watt | 260 Watt |
Peripherals |
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Max number of PCIe lanes | 4 | 4 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port1) may negotiate down to x2, or x1 | x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port1) may negotiate down to x2, or x1 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Idle States | ||
Instruction set extensions | Intel® AVX-512 | Intel® AVX-512 |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |