Intel Xeon Platinum 8276 vs Intel Xeon Platinum 8270
Comparative analysis of Intel Xeon Platinum 8276 and Intel Xeon Platinum 8270 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Platinum 8276
- 2 more cores, run more applications at once: 28 vs 26
- 4 more threads: 56 vs 52
- Around 6% higher maximum core temperature: 89°C vs 84°C
- Around 8% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 8% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 8% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 24% lower typical power consumption: 165 Watt vs 205 Watt
Number of cores | 28 vs 26 |
Number of threads | 56 vs 52 |
Maximum core temperature | 89°C vs 84°C |
L1 cache | 1792 KB vs 1664 KB |
L2 cache | 28 MB vs 26 MB |
L3 cache | 38.5 MB vs 35.75 MB |
Thermal Design Power (TDP) | 165 Watt vs 205 Watt |
Compare benchmarks
CPU 1: Intel Xeon Platinum 8276
CPU 2: Intel Xeon Platinum 8270
Name | Intel Xeon Platinum 8276 | Intel Xeon Platinum 8270 |
---|---|---|
PassMark - Single thread mark | 2325 | |
PassMark - CPU mark | 29986 |
Compare specifications (specs)
Intel Xeon Platinum 8276 | Intel Xeon Platinum 8270 | |
---|---|---|
Essentials |
||
Architecture codename | Cascade Lake | Cascade Lake |
Launch date | 11 Dec 2018 | 11 Dec 2018 |
Launch price (MSRP) | $9981 | $8477 |
Place in performance rating | not rated | 723 |
Processor Number | 8276 | 8270 |
Series | 2nd Generation Intel Xeon Scalable Processors | 2nd Generation Intel Xeon Scalable Processors |
Vertical segment | Server | Server |
Performance |
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Base frequency | 2.20 GHz | 2.70 GHz |
L1 cache | 1792 KB | 1664 KB |
L2 cache | 28 MB | 26 MB |
L3 cache | 38.5 MB | 35.75 MB |
Manufacturing process technology | 14 nm | 14 nm |
Maximum core temperature | 89°C | 84°C |
Maximum frequency | 4.00 GHz | 4.00 GHz |
Number of cores | 28 | 26 |
Number of threads | 56 | 52 |
Memory |
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Max memory channels | 6 | 6 |
Maximum memory size | 1 TB | 1 TB |
Supported memory frequency | 2933 MHz | 2933 MHz |
Supported memory types | DDR4-2933 | DDR4-2933 |
Compatibility |
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Package Size | 76.0mm x 56.5mm | 76.0mm x 56.5mm |
Sockets supported | FCLGA3647 | FCLGA3647 |
Thermal Design Power (TDP) | 165 Watt | 205 Watt |
Peripherals |
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Max number of PCIe lanes | 48 | 48 |
PCI Express revision | 3.0 | 3.0 |
Scalability | S8S | S8S |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Number of AVX-512 FMA Units | 2 | 2 |
Speed Shift technology | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |