Intel Xeon Platinum 8470 vs Intel Xeon Gold 6136

Comparative analysis of Intel Xeon Platinum 8470 and Intel Xeon Gold 6136 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon Platinum 8470

  • 40 more cores, run more applications at once: 52 vs 12
  • 80 more threads: 104 vs 24
  • Around 3% higher clock speed: 3.8 GHz vs 3.70 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
  • Around 45% better performance in PassMark - Single thread mark: 3153 vs 2170
  • 2.5x better performance in PassMark - CPU mark: 89850 vs 35966
Specifications (specs)
Number of cores 52 vs 12
Number of threads 104 vs 24
Maximum frequency 3.8 GHz vs 3.70 GHz
Manufacturing process technology 10 nm vs 14 nm
Benchmarks
PassMark - Single thread mark 3153 vs 2170
PassMark - CPU mark 89850 vs 35966

Reasons to consider the Intel Xeon Gold 6136

  • 2.3x lower typical power consumption: 150 Watt vs 350 Watt
Thermal Design Power (TDP) 150 Watt vs 350 Watt

Compare benchmarks

CPU 1: Intel Xeon Platinum 8470
CPU 2: Intel Xeon Gold 6136

PassMark - Single thread mark
CPU 1
CPU 2
3153
2170
PassMark - CPU mark
CPU 1
CPU 2
89850
35966
Name Intel Xeon Platinum 8470 Intel Xeon Gold 6136
PassMark - Single thread mark 3153 2170
PassMark - CPU mark 89850 35966
Geekbench 4 - Single Core 4351
Geekbench 4 - Multi-Core 31493

Compare specifications (specs)

Intel Xeon Platinum 8470 Intel Xeon Gold 6136

Essentials

Launch date 10 Jan 2023 Q3'17
Launch price (MSRP) $9359
Place in performance rating 46 64
Architecture codename Skylake
Processor Number 6136
Series Intel® Xeon® Scalable Processors
Status Launched
Vertical segment Server

Performance

Base frequency 2000 MHz 3.00 GHz
Die size 4x 477 mm²
L1 cache 80 KB (per core)
L2 cache 2 MB (per core)
L3 cache 105 MB
Manufacturing process technology 10 nm 14 nm
Maximum case temperature (TCase) 79°C
Maximum frequency 3.8 GHz 3.70 GHz
Number of cores 52 12
Number of threads 104 24
Unlocked
Maximum core temperature 85°C
Number of Ultra Path Interconnect (UPI) Links 3

Memory

ECC memory support
Supported memory types DDR5 DDR4-2666
Max memory channels 6
Maximum memory size 768 GB
Supported memory frequency 2666 MHz

Compatibility

Max number of CPUs in a configuration 2
Sockets supported 4677 FCLGA3647
Thermal Design Power (TDP) 350 Watt 150 Watt
Low Halogen Options Available
Package Size 76.0mm x 56.5mm

Peripherals

PCIe configurations Gen 5, 80 Lanes, (CPU only)
Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability S4S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)