Intel Xeon Platinum 8470 vs Intel Xeon Gold 6136

Comparative analysis of Intel Xeon Platinum 8470 and Intel Xeon Gold 6136 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Xeon Platinum 8470

Intel Xeon Gold 6136

Differences

Reasons to consider the Intel Xeon Platinum 8470

40 more cores, run more applications at once: 52 vs 12
80 more threads: 104 vs 24
Around 3% higher clock speed: 3.8 GHz vs 3.70 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
Around 45% better performance in PassMark - Single thread mark: 3153 vs 2170
2.6x better performance in PassMark - CPU mark: 89850 vs 34906

Specifications (specs)
Number of cores	52 vs 12
Number of threads	104 vs 24
Maximum frequency	3.8 GHz vs 3.70 GHz
Manufacturing process technology	10 nm vs 14 nm
Benchmarks
PassMark - Single thread mark	3153 vs 2170
PassMark - CPU mark	89850 vs 34906

Reasons to consider the Intel Xeon Gold 6136

2.3x lower typical power consumption: 150 Watt vs 350 Watt

Thermal Design Power (TDP)	150 Watt vs 350 Watt

Compare benchmarks

CPU 1: Intel Xeon Platinum 8470
CPU 2: Intel Xeon Gold 6136

PassMark - Single thread mark

CPU 1

CPU 2

3153

2170

PassMark - CPU mark

CPU 1

CPU 2

89850

34906

Name	Intel Xeon Platinum 8470	Intel Xeon Gold 6136
PassMark - Single thread mark	3153	2170
PassMark - CPU mark	89850	34906
Geekbench 4 - Single Core		4351
Geekbench 4 - Multi-Core		31493

Compare specifications (specs)

	Intel Xeon Platinum 8470	Intel Xeon Gold 6136
Essentials
Launch date	10 Jan 2023	Q3'17
Launch price (MSRP)	$9359
Place in performance rating	55	75
Architecture codename		Skylake
Processor Number		6136
Series		Intel® Xeon® Scalable Processors
Status		Launched
Vertical segment		Server
Performance
Base frequency	2000 MHz	3.00 GHz
Die size	4x 477 mm²
L1 cache	80 KB (per core)
L2 cache	2 MB (per core)
L3 cache	105 MB
Manufacturing process technology	10 nm	14 nm
Maximum case temperature (TCase)	79°C
Maximum frequency	3.8 GHz	3.70 GHz
Number of cores	52	12
Number of threads	104	24
Unlocked
Maximum core temperature		85°C
Number of Ultra Path Interconnect (UPI) Links		3
Memory
ECC memory support
Supported memory types	DDR5	DDR4-2666
Max memory channels		6
Maximum memory size		768 GB
Supported memory frequency		2666 MHz
Compatibility
Max number of CPUs in a configuration	2
Sockets supported	4677	FCLGA3647
Thermal Design Power (TDP)	350 Watt	150 Watt
Low Halogen Options Available
Package Size		76.0mm x 56.5mm
Peripherals
PCIe configurations	Gen 5, 80 Lanes, (CPU only)
Max number of PCIe lanes		48
PCI Express revision		3.0
Scalability		S4S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions		Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)