Intel Xeon Platinum 8470 vs Intel Xeon Gold 6144

Comparative analysis of Intel Xeon Platinum 8470 and Intel Xeon Gold 6144 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon Platinum 8470

  • 44 more cores, run more applications at once: 52 vs 8
  • 88 more threads: 104 vs 16
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
  • Around 28% better performance in PassMark - Single thread mark: 3153 vs 2461
  • 3x better performance in PassMark - CPU mark: 89850 vs 30209
Specifications (specs)
Number of cores 52 vs 8
Number of threads 104 vs 16
Manufacturing process technology 10 nm vs 14 nm
Benchmarks
PassMark - Single thread mark 3153 vs 2461
PassMark - CPU mark 89850 vs 30209

Reasons to consider the Intel Xeon Gold 6144

  • Around 11% higher clock speed: 4.20 GHz vs 3.8 GHz
  • 2.3x lower typical power consumption: 150 Watt vs 350 Watt
Maximum frequency 4.20 GHz vs 3.8 GHz
Thermal Design Power (TDP) 150 Watt vs 350 Watt

Compare benchmarks

CPU 1: Intel Xeon Platinum 8470
CPU 2: Intel Xeon Gold 6144

PassMark - Single thread mark
CPU 1
CPU 2
3153
2461
PassMark - CPU mark
CPU 1
CPU 2
89850
30209
Name Intel Xeon Platinum 8470 Intel Xeon Gold 6144
PassMark - Single thread mark 3153 2461
PassMark - CPU mark 89850 30209
Geekbench 4 - Single Core 4818
Geekbench 4 - Multi-Core 30845

Compare specifications (specs)

Intel Xeon Platinum 8470 Intel Xeon Gold 6144

Essentials

Launch date 10 Jan 2023 Q3'17
Launch price (MSRP) $9359
Place in performance rating 55 54
Architecture codename Skylake
Processor Number 6144
Series Intel® Xeon® Scalable Processors
Status Launched
Vertical segment Server

Performance

Base frequency 2000 MHz 3.50 GHz
Die size 4x 477 mm²
L1 cache 80 KB (per core)
L2 cache 2 MB (per core)
L3 cache 105 MB
Manufacturing process technology 10 nm 14 nm
Maximum case temperature (TCase) 79°C
Maximum frequency 3.8 GHz 4.20 GHz
Number of cores 52 8
Number of threads 104 16
Unlocked
Maximum core temperature 75°C
Number of Ultra Path Interconnect (UPI) Links 3

Memory

ECC memory support
Supported memory types DDR5 DDR4-2666
Max memory channels 6
Maximum memory size 768 GB
Supported memory frequency 2666 MHz

Compatibility

Max number of CPUs in a configuration 2
Sockets supported 4677 FCLGA3647
Thermal Design Power (TDP) 350 Watt 150 Watt
Low Halogen Options Available
Package Size 76.0mm x 56.5mm

Peripherals

PCIe configurations Gen 5, 80 Lanes, (CPU only)
Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability S4S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)