Intel Xeon Platinum 8480+ vs Intel Xeon Platinum 8170

Comparative analysis of Intel Xeon Platinum 8480+ and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon Platinum 8480+

  • 30 more cores, run more applications at once: 56 vs 26
  • 60 more threads: 112 vs 52
  • Around 3% higher clock speed: 3.80 GHz vs 3.70 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
  • 5.3x more maximum memory size: 4 TB vs 768 GB
Number of cores 56 vs 26
Number of threads 112 vs 52
Maximum frequency 3.80 GHz vs 3.70 GHz
Manufacturing process technology 7 nm vs 14 nm
Maximum memory size 4 TB vs 768 GB

Reasons to consider the Intel Xeon Platinum 8170

  • Around 13% higher maximum core temperature: 89°C vs 79°C
  • 2.1x lower typical power consumption: 165 Watt vs 350 Watt
Maximum core temperature 89°C vs 79°C
Thermal Design Power (TDP) 165 Watt vs 350 Watt

Compare benchmarks

CPU 1: Intel Xeon Platinum 8480+
CPU 2: Intel Xeon Platinum 8170

Name Intel Xeon Platinum 8480+ Intel Xeon Platinum 8170
PassMark - Single thread mark 3164
PassMark - CPU mark 131668
Geekbench 4 - Single Core 4221
Geekbench 4 - Multi-Core 33793

Compare specifications (specs)

Intel Xeon Platinum 8480+ Intel Xeon Platinum 8170

Essentials

Architecture codename Sapphire Rapids Skylake
Launch date 10 Jan 2023 Q3'17
Launch price (MSRP) $10710
Place in performance rating 7 4
Processor Number 8480+ 8170
Series 4th Generation Intel Xeon Scalable Processors Intel® Xeon® Scalable Processors
Vertical segment Server Server
Status Launched

Performance

Base frequency 2.00 GHz 2.10 GHz
L1 cache 80K (per core)
L2 cache 2MB (per core)
L3 cache 105 MB (shared)
Manufacturing process technology 7 nm 14 nm
Maximum core temperature 79°C 89°C
Maximum frequency 3.80 GHz 3.70 GHz
Number of cores 56 26
Number of threads 112 52
Number of Ultra Path Interconnect (UPI) Links 3

Memory

Max memory channels 8 6
Maximum memory size 4 TB 768 GB
Supported memory types Up to DDR5 4800 MT/s 1DPC, Up to DDR5 4400 MT/s 2DPC, DDR4-2666
Supported memory frequency 2666 MHz

Compatibility

Package Size 77.5mm x 56.5mm 76.0mm x 56.5mm
Sockets supported FCLGA4677 FCLGA3647
Thermal Design Power (TDP) 350 Watt 165 Watt
Low Halogen Options Available

Peripherals

Max number of PCIe lanes 80 48
PCI Express revision 5.0 3.0
Scalability 2S S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® OS Guard
Intel® Run Sure Technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Mode-based Execute Control (MBE)

Advanced Technologies

Instruction set extensions Intel AMX, Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Number of AVX-512 FMA Units 2 2
Speed Shift technology
Enhanced Intel SpeedStep® technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)