Intel Xeon Silver 4214 vs Intel Xeon E7-4890 v2

Comparative analysis of Intel Xeon Silver 4214 and Intel Xeon E7-4890 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon Silver 4214

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
  • Around 82% lower typical power consumption: 85 Watt vs 155 Watt
  • Around 2% better performance in PassMark - CPU mark: 25464 vs 25055
Specifications (specs)
Manufacturing process technology 14 nm vs 22 nm
Thermal Design Power (TDP) 85 Watt vs 155 Watt
Benchmarks
PassMark - Single thread mark 1791 vs 1790
PassMark - CPU mark 25464 vs 25055

Reasons to consider the Intel Xeon E7-4890 v2

  • 3 more cores, run more applications at once: 15 vs 12
  • 6 more threads: 30 vs 24
  • Around 6% higher clock speed: 3.40 GHz vs 3.20 GHz
  • Around 50% higher maximum memory size: 1.5 TB vs 1 TB
Number of cores 15 vs 12
Number of threads 30 vs 24
Maximum frequency 3.40 GHz vs 3.20 GHz
Maximum memory size 1.5 TB vs 1 TB

Compare benchmarks

CPU 1: Intel Xeon Silver 4214
CPU 2: Intel Xeon E7-4890 v2

PassMark - Single thread mark
CPU 1
CPU 2
1791
1790
PassMark - CPU mark
CPU 1
CPU 2
25464
25055
Name Intel Xeon Silver 4214 Intel Xeon E7-4890 v2
PassMark - Single thread mark 1791 1790
PassMark - CPU mark 25464 25055

Compare specifications (specs)

Intel Xeon Silver 4214 Intel Xeon E7-4890 v2

Essentials

Architecture codename Cascade Lake Ivy Bridge
Launch date 2 Apr 2019 Q1'14
Launch price (MSRP) $694-704
Place in performance rating 1042 1048
Processor Number 4214 E7-4890V2
Vertical segment Server Server
Series Intel® Xeon® Processor E7 v2 Family
Status Launched

Performance

Base frequency 2.20 GHz 2.80 GHz
L1 cache 768 KB
L2 cache 12 MB
L3 cache 16.5 MB
Manufacturing process technology 14 nm 22 nm
Maximum case temperature (TCase) 77 °C
Maximum frequency 3.20 GHz 3.40 GHz
Number of cores 12 15
Number of threads 24 30
Number of Ultra Path Interconnect (UPI) Links 2
64 bit support
Bus Speed 8 GT/s QPI
Maximum core temperature 77°C
Number of QPI Links 3

Memory

ECC memory support
Max memory channels 6 4
Maximum memory size 1 TB 1.5 TB
Supported memory frequency 2400 MHz
Supported memory types DDR4-2400 DDR3 1066/1333/1600
Maximum memory bandwidth 85 GB/s

Compatibility

Sockets supported FCLGA3647 FCLGA2011
Thermal Design Power (TDP) 85 Watt 155 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 4
Package Size 52mm x 45mm

Peripherals

Max number of PCIe lanes 48 32
PCI Express revision 3.0 3.0
Scalability 2S S4S
PCIe configurations x4, x8, x16

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Intel® OS Guard
Intel® Secure Key technology

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Speed Shift technology
Turbo Boost Max 3.0
Idle States
Intel® Instruction Replay Technology
Intel® TSX-NI
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)