Intel Xeon Silver 4310 vs Intel Xeon E5-2678 v3

Comparative analysis of Intel Xeon Silver 4310 and Intel Xeon E5-2678 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

 

Differences

Reasons to consider the Intel Xeon Silver 4310

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 22 nm
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Manufacturing process technology 10 nm vs 22 nm
L2 cache 12 MB vs 3 MB

Reasons to consider the Intel Xeon E5-2678 v3

  • Around 67% more L3 cache; more data can be stored in the L3 cache for quick access later
L3 cache 30 MB vs 18 MB

Compare benchmarks

CPU 1: Intel Xeon Silver 4310
CPU 2: Intel Xeon E5-2678 v3

Name Intel Xeon Silver 4310 Intel Xeon E5-2678 v3
PassMark - Single thread mark 1984
PassMark - CPU mark 34393
3DMark Fire Strike - Physics Score 7451

Compare specifications (specs)

Intel Xeon Silver 4310 Intel Xeon E5-2678 v3

Essentials

Architecture codename Ice Lake Haswell-EP
Launch date 6 Apr 2021
Launch price (MSRP) $501 - $511
Place in performance rating 873 867
Processor Number 4310 E5-2678 v3
Series 3rd Generation Intel Xeon Scalable Processors
Status Launched
Vertical segment Server Server
Family Intel Xeon E5-2600 v3

Performance

Base frequency 2.10 GHz 2500 MHz
L1 cache 768 KB 768 KB
L2 cache 12 MB 3 MB
L3 cache 18 MB 30 MB
Manufacturing process technology 10 nm 22 nm
Maximum core temperature 82°C
Maximum frequency 3.30 GHz
Number of cores 12 12
Number of threads 24 24
Number of Ultra Path Interconnect (UPI) Links 2
64 bit support
Bus Speed 5 GT/s DMI

Memory

Max memory channels 8 2
Maximum memory size 6 TB
Supported memory frequency 2667 MHz
Supported memory types DDR4-2667 DDR4

Compatibility

Package Size 77.5mm x 56.5mm
Sockets supported FCLGA4189 LGA2011-3 (R3)
Thermal Design Power (TDP) 120 Watt 120 Watt
Max number of CPUs in a configuration 2

Peripherals

Max number of PCIe lanes 64 40
PCI Express revision 4.0 3.0
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Instruction set extensions Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units 2
Speed Shift technology
Enhanced Intel SpeedStep® technology
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® TSX-NI

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)