Intel Xeon W-3375 vs Intel Mobile Pentium 4 HT 552

Comparative analysis of Intel Xeon W-3375 and Intel Mobile Pentium 4 HT 552 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Xeon W-3375

Intel Mobile Pentium 4 HT 552

Differences

Reasons to consider the Intel Xeon W-3375

CPU is newer: launch date 16 year(s) 6 month(s) later
37 more cores, run more applications at once: 38 vs 1
Around 15% higher clock speed: 4.00 GHz vs 3.47 GHz
Around 7% higher maximum core temperature: 80°C vs 75°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 90 nm
304x more L1 cache, more data can be stored in the L1 cache for quick access later
38x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	29 Jul 2021 vs January 2005
Number of cores	38 vs 1
Maximum frequency	4.00 GHz vs 3.47 GHz
Maximum core temperature	80°C vs 75°C
Manufacturing process technology	10 nm vs 90 nm
L1 cache	2432 KB vs 8 KB
L2 cache	38 MB vs 1024 KB

Reasons to consider the Intel Mobile Pentium 4 HT 552

3.1x lower typical power consumption: 88 Watt vs 270 Watt

Thermal Design Power (TDP)	88 Watt vs 270 Watt

Compare benchmarks

CPU 1: Intel Xeon W-3375
CPU 2: Intel Mobile Pentium 4 HT 552

Name	Intel Xeon W-3375	Intel Mobile Pentium 4 HT 552
PassMark - Single thread mark	2636
PassMark - CPU mark	59091

Compare specifications (specs)

	Intel Xeon W-3375	Intel Mobile Pentium 4 HT 552
Essentials
Architecture codename	Ice Lake	Prescott
Launch date	29 Jul 2021	January 2005
Launch price (MSRP)	$4951
Place in performance rating	308	not rated
Processor Number	W-3375	552
Series	Intel Xeon W Processor	Legacy Intel® Pentium® Processor
Vertical segment	Workstation	Mobile
Status		Discontinued
Performance
Base frequency	2.50 GHz	3.46 GHz
Bus Speed	8 GT/s	533 MHz FSB
L1 cache	2432 KB	8 KB
L2 cache	38 MB	1024 KB
L3 cache	57 MB
Manufacturing process technology	10 nm	90 nm
Maximum core temperature	80°C	75°C
Maximum frequency	4.00 GHz	3.47 GHz
Number of cores	38	1
Number of threads	76
Die size		112 mm2
Maximum case temperature (TCase)		75 °C
Transistor count		125 million
VID voltage range		1.250V-1.4V
Memory
Max memory channels	8
Maximum memory size	4 TB
Supported memory frequency	3200 MHz
Supported memory types	DDR4-3200	DDR1, DDR2
Compatibility
Package Size	77.5mm x 56.5mm	35mm x 35mm
Sockets supported	FCLGA4189	PPGA478
Thermal Design Power (TDP)	270 Watt	88 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Peripherals
Max number of PCIe lanes	64
PCI Express revision	4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions	Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units	2
Speed Shift technology
FSB parity
Idle States
Intel® Demand Based Switching
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)