AMD FireStream 9170 vs ATI FireGL V7600

Comparative analysis of AMD FireStream 9170 and ATI FireGL V7600 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark.

 

Differences

Reasons to consider the AMD FireStream 9170

  • Around 33% higher core clock speed: 800 MHz vs 600 MHz
  • Around 78% higher texture fill rate: 12.8 GTexel / s vs 7.2 GTexel / s
  • Around 33% higher pipelines: 320 vs 240
  • Around 78% better floating-point performance: 512.0 gflops vs 288 gflops
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 80 nm
  • Around 21% lower typical power consumption: 105 Watt vs 127 Watt
  • 4x more maximum memory size: 2 GB vs 512 MB
  • Around 1% better performance in PassMark - G2D Mark: 493 vs 488
  • Around 5% better performance in PassMark - G3D Mark: 647 vs 616
Specifications (specs)
Core clock speed 800 MHz vs 600 MHz
Texture fill rate 12.8 GTexel / s vs 7.2 GTexel / s
Pipelines 320 vs 240
Floating-point performance 512.0 gflops vs 288 gflops
Manufacturing process technology 55 nm vs 80 nm
Thermal Design Power (TDP) 105 Watt vs 127 Watt
Maximum memory size 2 GB vs 512 MB
Benchmarks
PassMark - G2D Mark 493 vs 488
PassMark - G3D Mark 647 vs 616

Compare benchmarks

GPU 1: AMD FireStream 9170
GPU 2: ATI FireGL V7600

PassMark - G2D Mark
GPU 1
GPU 2
493
488
PassMark - G3D Mark
GPU 1
GPU 2
647
616
Name AMD FireStream 9170 ATI FireGL V7600
PassMark - G2D Mark 493 488
PassMark - G3D Mark 647 616

Compare specifications (specs)

AMD FireStream 9170 ATI FireGL V7600

Essentials

Architecture TeraScale TeraScale
Code name RV670 R600
Launch date 8 November 2007 6 November 2007
Place in performance rating 169 174
Type Desktop Workstation
Launch price (MSRP) $999

Technical info

Core clock speed 800 MHz 600 MHz
Floating-point performance 512.0 gflops 288 gflops
Manufacturing process technology 55 nm 80 nm
Pipelines 320 240
Texture fill rate 12.8 GTexel / s 7.2 GTexel / s
Thermal Design Power (TDP) 105 Watt 127 Watt
Transistor count 666 million 720 million

Video outputs and ports

Display Connectors 2x DVI, 1x S-Video 2x DVI, 1x S-Video

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16 PCIe 1.0 x16
Supplementary power connectors 1x 6-pin 1x 8-pin
Length 254 mm

API support

DirectX 10.0 10.0
OpenGL 3.3 3.3

Memory

Maximum RAM amount 2 GB 512 MB
Memory bandwidth 51.2 GB / s 51.2 GB / s
Memory bus width 256 Bit 256 Bit
Memory clock speed 1600 MHz 1600 MHz
Memory type GDDR3 GDDR3