AMD Radeon HD 7950M vs NVIDIA GeForce GT 630 OEM

Comparative analysis of AMD Radeon HD 7950M and NVIDIA GeForce GT 630 OEM videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps).

 

Differences

Reasons to consider the AMD Radeon HD 7950M

  • 6.7x more pipelines: 1280 vs 192
  • 2x more maximum memory size: 2 GB vs 1 GB
  • 2.2x more memory clock speed: 4000 MHz vs 1782 MHz
Pipelines 1280 vs 192
Maximum memory size 2 GB vs 1 GB
Memory clock speed 4000 MHz vs 1782 MHz

Reasons to consider the NVIDIA GeForce GT 630 OEM

  • Around 25% higher core clock speed: 875 MHz vs 700 MHz
  • Around 50% lower typical power consumption: 50 Watt vs 75 Watt
Core clock speed 875 MHz vs 700 MHz
Thermal Design Power (TDP) 50 Watt vs 75 Watt

Compare benchmarks

GPU 1: AMD Radeon HD 7950M
GPU 2: NVIDIA GeForce GT 630 OEM

Name AMD Radeon HD 7950M NVIDIA GeForce GT 630 OEM
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 2.907
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 182.993
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.475
CompuBench 1.5 Desktop - Video Composition (Frames/s) 7.65
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 18.19
GFXBench 4.0 - Manhattan (Frames) 2029
GFXBench 4.0 - Manhattan (Fps) 2029

Compare specifications (specs)

AMD Radeon HD 7950M NVIDIA GeForce GT 630 OEM

Essentials

Architecture GCN 1.0 Kepler
Code name Wimbledon GK107
Launch date 24 April 2012 24 April 2012
Place in performance rating not rated 1514
Type Laptop Desktop

Technical info

Core clock speed 700 MHz 875 MHz
Manufacturing process technology 28 nm 28 nm
Pipelines 1280 192
Thermal Design Power (TDP) 75 Watt 50 Watt
Transistor count 2,800 million 1,270 million
Floating-point performance 336.0 gflops
Texture fill rate 14 GTexel / s

Video outputs and ports

Display Connectors No outputs 1x DVI, 1x HDMI, 1x VGA

Compatibility, dimensions and requirements

Interface MXM-B (3.0) PCIe 3.0 x16
Laptop size large
Length 145 mm
Supplementary power connectors None

API support

DirectX 12.0 (11_1) 12.0 (11_0)
OpenGL 4.5 4.6

Memory

Maximum RAM amount 2 GB 1 GB
Memory bus width 256 Bit 128 Bit
Memory clock speed 4000 MHz 1782 MHz
Memory type GDDR5 DDR3
Shared memory 0
Memory bandwidth 28.51 GB / s

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