AMD Radeon HD 8760 OEM vs ATI Mobility Radeon HD 3670

Comparative analysis of AMD Radeon HD 8760 OEM and ATI Mobility Radeon HD 3670 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the AMD Radeon HD 8760 OEM

  • Videocard is newer: launch date 5 year(s) 0 month(s) later
  • Around 47% higher core clock speed: 1000 MHz vs 680 MHz
  • 7.4x more texture fill rate: 40 GTexel / s vs 5.44 GTexel / s
  • 5.3x more pipelines: 640 vs 120
  • 7.8x better floating-point performance: 1,280 gflops vs 163.2 gflops
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 55 nm
  • 8x more maximum memory size: 2 GB vs 256 MB
  • 2.8x more memory clock speed: 4500 MHz vs 1600 MHz
Launch date 8 January 2013 vs 7 January 2008
Core clock speed 1000 MHz vs 680 MHz
Texture fill rate 40 GTexel / s vs 5.44 GTexel / s
Pipelines 640 vs 120
Floating-point performance 1,280 gflops vs 163.2 gflops
Manufacturing process technology 28 nm vs 55 nm
Maximum memory size 2 GB vs 256 MB
Memory clock speed 4500 MHz vs 1600 MHz

Reasons to consider the ATI Mobility Radeon HD 3670

  • 2.7x lower typical power consumption: 30 Watt vs 80 Watt
Thermal Design Power (TDP) 30 Watt vs 80 Watt

Compare benchmarks

GPU 1: AMD Radeon HD 8760 OEM
GPU 2: ATI Mobility Radeon HD 3670

Name AMD Radeon HD 8760 OEM ATI Mobility Radeon HD 3670
Geekbench - OpenCL 45762
PassMark - G3D Mark 232
PassMark - G2D Mark 331

Compare specifications (specs)

AMD Radeon HD 8760 OEM ATI Mobility Radeon HD 3670

Essentials

Architecture GCN 1.0 TeraScale
Code name Cape Verde M86
Launch date 8 January 2013 7 January 2008
Place in performance rating 476 478
Type Desktop Laptop

Technical info

Core clock speed 1000 MHz 680 MHz
Floating-point performance 1,280 gflops 163.2 gflops
Manufacturing process technology 28 nm 55 nm
Pipelines 640 120
Texture fill rate 40 GTexel / s 5.44 GTexel / s
Thermal Design Power (TDP) 80 Watt 30 Watt
Transistor count 1,500 million 378 million

Video outputs and ports

Display Connectors 1x DVI, 1x HDMI, 2x mini-DisplayPort No outputs

Compatibility, dimensions and requirements

Interface PCIe 3.0 x16 PCIe 2.0 x16
Length 210 mm
Supplementary power connectors 1x 6-pin
Laptop size medium sized

API support

DirectX 12.0 10.1
OpenGL 4.5 3.3

Memory

Maximum RAM amount 2 GB 256 MB
Memory bandwidth 72 GB / s 25.6 GB / s
Memory bus width 128 Bit 128 Bit
Memory clock speed 4500 MHz 1600 MHz
Memory type GDDR5 DDR2 / GDDR3 / GDDR4
Shared memory 0