AMD Radeon RX Vega 11 Mobile vs NVIDIA GRID M40

Comparative analysis of AMD Radeon RX Vega 11 Mobile and NVIDIA GRID M40 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: 3DMark Fire Strike - Graphics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the AMD Radeon RX Vega 11 Mobile

  • Videocard is newer: launch date 1 year(s) 11 month(s) later
  • Around 25% higher boost clock speed: 1250 MHz vs 1000 MHz
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 14 nm vs 28 nm
  • Around 43% lower typical power consumption: 35 Watt vs 50 Watt
Launch date 15 May 2018 vs 18 May 2016
Boost clock speed 1250 MHz vs 1000 MHz
Manufacturing process technology 14 nm vs 28 nm
Thermal Design Power (TDP) 35 Watt vs 50 Watt

Reasons to consider the NVIDIA GRID M40

  • 3.1x more core clock speed: 930 MHz vs 300 MHz
Core clock speed 930 MHz vs 300 MHz

Compare benchmarks

GPU 1: AMD Radeon RX Vega 11 Mobile
GPU 2: NVIDIA GRID M40

Name AMD Radeon RX Vega 11 Mobile NVIDIA GRID M40
3DMark Fire Strike - Graphics Score 1167
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 28.064
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 576.664
CompuBench 1.5 Desktop - Video Composition (Frames/s) 18.529
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 87.629

Compare specifications (specs)

AMD Radeon RX Vega 11 Mobile NVIDIA GRID M40

Essentials

Architecture GCN 5.0 Maxwell
Code name Raven GM107
Launch date 15 May 2018 18 May 2016
Place in performance rating 1453 1431
Type Desktop Workstation

Technical info

Boost clock speed 1250 MHz 1000 MHz
Core clock speed 300 MHz 930 MHz
Floating-point performance 1,830 gflops
Manufacturing process technology 14 nm 28 nm
Pipelines 704
Texture fill rate 57.2 GTexel / s
Thermal Design Power (TDP) 35 Watt 50 Watt
Transistor count 4,940 million 1,870 million

Video outputs and ports

Display Connectors No outputs No outputs

Compatibility, dimensions and requirements

Interface IGP PCIe 3.0 x16

API support

DirectX 12.0 (12_1) 12.0 (11_0)
OpenGL 4.6 4.6

Memory

Maximum RAM amount 256 MB
Memory bandwidth 12.8 GB / s
Memory bus width 128 Bit
Memory type DDR4
Memory clock speed 5400 MHz