ATI FireGL V3600 vs ATI Mobility Radeon X600 SE

Comparative analysis of ATI FireGL V3600 and ATI Mobility Radeon X600 SE videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the ATI FireGL V3600

  • Videocard is newer: launch date 3 year(s) 0 month(s) later
  • Around 50% higher core clock speed: 600 MHz vs 400 MHz
  • 3x more texture fill rate: 4.8 GTexel / s vs 1.6 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 65 nm vs 130 nm
  • 4x more maximum memory size: 256 MB vs 64 MB
  • 2x more memory clock speed: 1000 MHz vs 500 MHz
  • 3.7x better performance in PassMark - G3D Mark: 180 vs 49
  • Around 71% better performance in PassMark - G2D Mark: 399 vs 233
Specifications (specs)
Launch date 28 June 2007 vs 1 June 2004
Core clock speed 600 MHz vs 400 MHz
Texture fill rate 4.8 GTexel / s vs 1.6 GTexel / s
Manufacturing process technology 65 nm vs 130 nm
Maximum memory size 256 MB vs 64 MB
Memory clock speed 1000 MHz vs 500 MHz
Benchmarks
PassMark - G3D Mark 180 vs 49
PassMark - G2D Mark 399 vs 233

Compare benchmarks

GPU 1: ATI FireGL V3600
GPU 2: ATI Mobility Radeon X600 SE

PassMark - G3D Mark
GPU 1
GPU 2
180
49
PassMark - G2D Mark
GPU 1
GPU 2
399
233
Name ATI FireGL V3600 ATI Mobility Radeon X600 SE
PassMark - G3D Mark 180 49
PassMark - G2D Mark 399 233
GFXBench 4.0 - T-Rex (Frames) 1755
GFXBench 4.0 - T-Rex (Fps) 1755

Compare specifications (specs)

ATI FireGL V3600 ATI Mobility Radeon X600 SE

Essentials

Architecture TeraScale Rage 9
Code name RV630 M24
Launch date 28 June 2007 1 June 2004
Launch price (MSRP) $299
Place in performance rating 745 748
Type Workstation Desktop

Technical info

Core clock speed 600 MHz 400 MHz
Floating-point performance 144 gflops
Manufacturing process technology 65 nm 130 nm
Pipelines 120
Texture fill rate 4.8 GTexel / s 1.6 GTexel / s
Thermal Design Power (TDP) 73 Watt
Transistor count 390 million 75 million

Video outputs and ports

Display Connectors No outputs No outputs

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16 PCIe 1.0 x16
Supplementary power connectors None

API support

DirectX 10.0 9.0b
OpenGL 3.3 2.0

Memory

Maximum RAM amount 256 MB 64 MB
Memory bandwidth 16 GB / s 8 GB / s
Memory bus width 128 Bit 128 Bit
Memory clock speed 1000 MHz 500 MHz
Memory type DDR2 DDR