ATI Radeon E4690 vs ATI Mobility Radeon X2300 HD

Comparative analysis of ATI Radeon E4690 and ATI Mobility Radeon X2300 HD videocards for all known characteristics in the following categories: Essentials, Technical info, Compatibility, dimensions and requirements, API support, Memory, Video outputs and ports. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the ATI Radeon E4690

  • Videocard is newer: launch date 2 year(s) 3 month(s) later
  • Around 25% higher core clock speed: 600 MHz vs 479 MHz
  • 10x more texture fill rate: 19.2 GTexel / s vs 1.916 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 80 nm
  • 2x more maximum memory size: 512 MB vs 256 MB
  • Around 85% higher memory clock speed: 1400 MHz vs 756 MHz
  • 8.3x better performance in PassMark - G3D Mark: 405 vs 49
  • Around 42% better performance in PassMark - G2D Mark: 347 vs 244
Specifications (specs)
Launch date 1 June 2009 vs 1 March 2007
Core clock speed 600 MHz vs 479 MHz
Texture fill rate 19.2 GTexel / s vs 1.916 GTexel / s
Manufacturing process technology 55 nm vs 80 nm
Maximum memory size 512 MB vs 256 MB
Memory clock speed 1400 MHz vs 756 MHz
Benchmarks
PassMark - G3D Mark 405 vs 49
PassMark - G2D Mark 347 vs 244

Compare benchmarks

GPU 1: ATI Radeon E4690
GPU 2: ATI Mobility Radeon X2300 HD

PassMark - G3D Mark
GPU 1
GPU 2
405
49
PassMark - G2D Mark
GPU 1
GPU 2
347
244
Name ATI Radeon E4690 ATI Mobility Radeon X2300 HD
PassMark - G3D Mark 405 49
PassMark - G2D Mark 347 244
GFXBench 4.0 - T-Rex (Frames) 3302
GFXBench 4.0 - T-Rex (Fps) 3302

Compare specifications (specs)

ATI Radeon E4690 ATI Mobility Radeon X2300 HD

Essentials

Architecture TeraScale R500
Code name RV730 M71
Launch date 1 June 2009 1 March 2007
Place in performance rating 743 744
Type Desktop Desktop

Technical info

Core clock speed 600 MHz 479 MHz
Floating-point performance 384.0 gflops
Manufacturing process technology 55 nm 80 nm
Pipelines 320
Texture fill rate 19.2 GTexel / s 1.916 GTexel / s
Thermal Design Power (TDP) 30 Watt
Transistor count 514 million 107 million

Compatibility, dimensions and requirements

Interface MXM-II PCIe 1.0 x16

API support

DirectX 10.1 9.0c
OpenGL 3.3 2.0

Memory

Maximum RAM amount 512 MB 256 MB
Memory bandwidth 22.4 GB / s 3.024 GB / s
Memory bus width 128 Bit 32 Bit
Memory clock speed 1400 MHz 756 MHz
Memory type GDDR3 DDR2

Video outputs and ports

Display Connectors No outputs