Intel UHD Graphics G1 (Ice Lake 32 EU) vs ATI Mobility Radeon X700

Comparative analysis of Intel UHD Graphics G1 (Ice Lake 32 EU) and ATI Mobility Radeon X700 videocards for all known characteristics in the following categories: Essentials, Technical info, API support, Memory, Technologies, Video outputs and ports, Compatibility, dimensions and requirements. Benchmark videocards performance analysis: GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the Intel UHD Graphics G1 (Ice Lake 32 EU)

  • Videocard is newer: launch date 14 year(s) 2 month(s) later
  • 3.1x more boost clock speed: 1100 MHz vs 350 MHz
  • 4x more pipelines: 32 vs 8
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 10 nm vs 110 nm
Launch date 28 May 2019 vs 1 March 2005
Boost clock speed 1100 MHz vs 350 MHz
Pipelines 32 vs 8
Manufacturing process technology 10 nm vs 110 nm

Reasons to consider the ATI Mobility Radeon X700

  • Around 17% higher core clock speed: 350 MHz vs 300 MHz
Core clock speed 350 MHz vs 300 MHz

Compare benchmarks

GPU 1: Intel UHD Graphics G1 (Ice Lake 32 EU)
GPU 2: ATI Mobility Radeon X700

Name Intel UHD Graphics G1 (Ice Lake 32 EU) ATI Mobility Radeon X700
GFXBench 4.0 - Car Chase Offscreen (Frames) 1887
GFXBench 4.0 - Car Chase Offscreen (Fps) 1887
GFXBench 4.0 - Manhattan (Frames) 3505
GFXBench 4.0 - Manhattan (Fps) 3505
GFXBench 4.0 - T-Rex (Frames) 3352
GFXBench 4.0 - T-Rex (Fps) 3352
PassMark - G3D Mark 67
PassMark - G2D Mark 200

Compare specifications (specs)

Intel UHD Graphics G1 (Ice Lake 32 EU) ATI Mobility Radeon X700

Essentials

Architecture Intel Gen. 11 (Ice Lake) R400
Code name Ice Lake G1 Gen. 11 M26
Launch date 28 May 2019 1 March 2005
Place in performance rating 884 882
Type Laptop Laptop

Technical info

Boost clock speed 1100 MHz 350 MHz
Core clock speed 300 MHz 350 MHz
Manufacturing process technology 10 nm 110 nm
Pipelines 32 8
Thermal Design Power (TDP) 25 Watt
Texture fill rate 2.8 GTexel / s
Transistor count 120 million

API support

DirectX 12.1 9.0b
OpenGL 2.0

Memory

Memory type DDR4 128
Shared memory Yes 0
Maximum RAM amount 128 MB
Memory bandwidth 11.2 GB / s
Memory bus width 350 Bit
Memory clock speed 600 MHz

Technologies

Quick Sync
PCIe

Video outputs and ports

Display Connectors No outputs

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16
Laptop size medium sized