NVIDIA GeForce Go 6800 Ultra vs NVIDIA GeForce 256 DDR

Comparative analysis of NVIDIA GeForce Go 6800 Ultra and NVIDIA GeForce 256 DDR videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the NVIDIA GeForce Go 6800 Ultra

  • Videocard is newer: launch date 5 year(s) 0 month(s) later
  • 3.8x more core clock speed: 450 MHz vs 120 MHz
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 130 nm vs 220 nm
  • 8x more maximum memory size: 256 MB vs 32 MB
  • 4x more memory clock speed: 1200 MHz vs 300 MHz
  • 27.6x better performance in PassMark - G3D Mark: 138 vs 5
Specifications (specs)
Launch date 24 February 2005 vs 1 February 2000
Core clock speed 450 MHz vs 120 MHz
Manufacturing process technology 130 nm vs 220 nm
Maximum memory size 256 MB vs 32 MB
Memory clock speed 1200 MHz vs 300 MHz
Benchmarks
PassMark - G3D Mark 138 vs 5

Reasons to consider the NVIDIA GeForce 256 DDR

  • 88.9x more texture fill rate: 480 MTexel / s vs 5.4 GTexel / s
  • Around 2% better performance in PassMark - G2D Mark: 201 vs 198
Specifications (specs)
Texture fill rate 480 MTexel / s vs 5.4 GTexel / s
Benchmarks
PassMark - G2D Mark 201 vs 198

Compare benchmarks

GPU 1: NVIDIA GeForce Go 6800 Ultra
GPU 2: NVIDIA GeForce 256 DDR

PassMark - G3D Mark
GPU 1
GPU 2
138
5
PassMark - G2D Mark
GPU 1
GPU 2
198
201
Name NVIDIA GeForce Go 6800 Ultra NVIDIA GeForce 256 DDR
PassMark - G3D Mark 138 5
PassMark - G2D Mark 198 201

Compare specifications (specs)

NVIDIA GeForce Go 6800 Ultra NVIDIA GeForce 256 DDR

Essentials

Architecture Curie Celsius
Code name NV41 NV10 A3
Launch date 24 February 2005 1 February 2000
Place in performance rating 883 884
Type Laptop Desktop

Technical info

Boost clock speed 450 MHz
Core clock speed 450 MHz 120 MHz
Manufacturing process technology 130 nm 220 nm
Pipelines 12
Texture fill rate 5.4 GTexel / s 480 MTexel / s
Thermal Design Power (TDP) 89 Watt
Transistor count 222 million 17 million

Video outputs and ports

Display Connectors No outputs 1x VGA

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16 AGP 4x
Laptop size large
Supplementary power connectors None None

API support

DirectX 9.0c 7.0
OpenGL 2.1 1.2

Memory

Maximum RAM amount 256 MB 32 MB
Memory bandwidth 38.4 GB / s 4.8 GB / s
Memory bus width 600 Bit 128 Bit
Memory clock speed 1200 MHz 300 MHz
Memory type 256 DDR
Shared memory 0