NVIDIA Quadro NVS 130M vs NVIDIA Quadro4 900 XGL

Comparative analysis of NVIDIA Quadro NVS 130M and NVIDIA Quadro4 900 XGL videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

NVIDIA Quadro NVS 130M

NVIDIA Quadro4 900 XGL

Differences

Reasons to consider the NVIDIA Quadro NVS 130M

Videocard is newer: launch date 5 year(s) 2 month(s) later
Around 33% higher core clock speed: 400 MHz vs 300 MHz
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 80 nm vs 150 nm
2x more maximum memory size: 256 MB vs 128 MB
2.2x more memory clock speed: 1400 MHz vs 650 MHz
19.4x better performance in PassMark - G3D Mark: 97 vs 5

Specifications (specs)
Launch date	9 May 2007 vs 19 February 2002
Core clock speed	400 MHz vs 300 MHz
Manufacturing process technology	80 nm vs 150 nm
Maximum memory size	256 MB vs 128 MB
Memory clock speed	1400 MHz vs 650 MHz
Benchmarks
PassMark - G3D Mark	97 vs 5

Reasons to consider the NVIDIA Quadro4 900 XGL

Around 50% higher texture fill rate: 2.4 GTexel / s vs 1.6 GTexel / s
Around 2% better performance in PassMark - G2D Mark: 194 vs 190

Specifications (specs)
Texture fill rate	2.4 GTexel / s vs 1.6 GTexel / s
Benchmarks
PassMark - G2D Mark	194 vs 190

Compare benchmarks

GPU 1: NVIDIA Quadro NVS 130M
GPU 2: NVIDIA Quadro4 900 XGL

PassMark - G3D Mark

GPU 1

GPU 2

PassMark - G2D Mark

GPU 1

GPU 2

190

194

Name	NVIDIA Quadro NVS 130M	NVIDIA Quadro4 900 XGL
PassMark - G3D Mark	97	5
PassMark - G2D Mark	190	194

Compare specifications (specs)

	NVIDIA Quadro NVS 130M	NVIDIA Quadro4 900 XGL
Essentials
Architecture	Tesla	Kelvin
Code name	G86	NV25 A2
Launch date	9 May 2007	19 February 2002
Place in performance rating	907	910
Type	Mobile workstation	Workstation
Technical info
Core clock speed	400 MHz	300 MHz
Floating-point performance	12.8 gflops
Manufacturing process technology	80 nm	150 nm
Pipelines	8
Texture fill rate	1.6 GTexel / s	2.4 GTexel / s
Thermal Design Power (TDP)	10 Watt
Transistor count	210 million	63 million
Video outputs and ports
Display Connectors	No outputs	2x DVI, 1x S-Video
HDMI
Compatibility, dimensions and requirements
Interface	PCIe 2.0 x16	AGP 4x
Supplementary power connectors		None
API support
DirectX	10.0	8.1
OpenGL	3.3	1.3
Memory
Maximum RAM amount	256 MB	128 MB
Memory bandwidth	11.2 GB / s	10.4 GB / s
Memory bus width	64 Bit	128 Bit
Memory clock speed	1400 MHz	650 MHz
Memory type	GDDR3, GDDR2	DDR
Shared memory	yes
Technologies
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