NVIDIA Tesla P100 SXM2 vs AMD Radeon HD 7850M

Comparative analysis of NVIDIA Tesla P100 SXM2 and AMD Radeon HD 7850M videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G3D Mark, PassMark - G2D Mark.

NVIDIA Tesla P100 SXM2

AMD Radeon HD 7850M

Differences

Reasons to consider the NVIDIA Tesla P100 SXM2

Videocard is newer: launch date 3 year(s) 11 month(s) later
Around 97% higher core clock speed: 1328 MHz vs 675 MHz
12.3x more texture fill rate: 331.5 GTexel / s vs 27 GTexel / s
5.6x more pipelines: 3584 vs 640
12.3x better floating-point performance: 10,609 gflops vs 864.0 gflops
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 16 nm vs 28 nm
8x more maximum memory size: 16 GB vs 2 GB

Launch date	5 April 2016 vs 24 April 2012
Core clock speed	1328 MHz vs 675 MHz
Texture fill rate	331.5 GTexel / s vs 27 GTexel / s
Pipelines	3584 vs 640
Floating-point performance	10,609 gflops vs 864.0 gflops
Manufacturing process technology	16 nm vs 28 nm
Maximum memory size	16 GB vs 2 GB

Reasons to consider the AMD Radeon HD 7850M

7.5x lower typical power consumption: 40 Watt vs 300 Watt
2.8x more memory clock speed: 4000 MHz vs 1408 MHz

Thermal Design Power (TDP)	40 Watt vs 300 Watt
Memory clock speed	4000 MHz vs 1408 MHz

Compare benchmarks

GPU 1: NVIDIA Tesla P100 SXM2
GPU 2: AMD Radeon HD 7850M

Name	NVIDIA Tesla P100 SXM2	AMD Radeon HD 7850M
Geekbench - OpenCL	76222
PassMark - G3D Mark		1373
PassMark - G2D Mark		566

Compare specifications (specs)

	NVIDIA Tesla P100 SXM2	AMD Radeon HD 7850M
Essentials
Architecture	Pascal	GCN 1.0
Code name	GP100	Heathrow
Launch date	5 April 2016	24 April 2012
Place in performance rating	256	257
Type	Desktop	Laptop
Technical info
Boost clock speed	1480 MHz
Core clock speed	1328 MHz	675 MHz
Floating-point performance	10,609 gflops	864.0 gflops
Manufacturing process technology	16 nm	28 nm
Pipelines	3584	640
Texture fill rate	331.5 GTexel / s	27 GTexel / s
Thermal Design Power (TDP)	300 Watt	40 Watt
Transistor count	15,300 million	1,500 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x16	PCIe 3.0 x16
Supplementary power connectors	None
Laptop size		large
API support
DirectX	12.0 (12_1)	12.0 (11_1)
OpenGL	4.6	4.5
Memory
Maximum RAM amount	16 GB	2 GB
Memory bandwidth	720.9 GB / s	64 GB / s
Memory bus width	4096 Bit	128 Bit
Memory clock speed	1408 MHz	4000 MHz
Memory type	HBM2	GDDR5
Shared memory		0