Family |
AMD Ryzen Processors |
|
Date de sortie |
19 April 2018 |
June 2013 |
OPN Tray |
YD2400C6M4MFB |
|
OS Support |
Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit |
|
Position dans l’évaluation de la performance |
1177 |
1178 |
Série |
AMD Ryzen 5 Desktop Processors with Radeon Vega Graphics |
4th Generation Intel® Core™ i5 Processors |
Segment vertical |
Desktop |
Desktop |
Nom de code de l’architecture |
|
Crystal Well |
Prix maintenant |
|
$276 |
Processor Number |
|
i5-4670R |
Status |
|
Discontinued |
Valeur pour le prix (0-100) |
|
7.92 |
Base frequency |
3.2 GHz |
3.00 GHz |
Cache L1 |
384 KB |
64 KB (per core) |
Cache L2 |
2 MB |
256 KB (per core) |
Cache L3 |
4 MB |
4096 KB (shared) |
Processus de fabrication |
14 nm FinFET |
22 nm |
Température de noyau maximale |
95°C |
|
Fréquence maximale |
3.8 GHz |
3.70 GHz |
Nombre de noyaux |
4 |
4 |
Number of GPU cores |
11 |
|
Nombre de fils |
8 |
4 |
Ouvert |
|
|
Soutien de 64-bit |
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|
Bus Speed |
|
5 GT/s DMI2 |
Taille de dé |
|
177 mm |
Température maximale de la caisse (TCase) |
|
71 °C |
Number of QPI Links |
|
0 |
Compte de transistor |
|
1400 million |
Réseaux de mémoire maximale |
2 |
2 |
Supported memory frequency |
2933 MHz |
|
Bande passante de mémoire maximale |
|
25.6 GB/s |
Taille de mémore maximale |
|
32 GB |
Genres de mémoire soutenus |
|
DDR3 and DDR3L 1333/1600 at 1.5V |
Freéquency maximale des graphiques |
1250 MHz |
1.3 GHz |
Compte de noyaux iGPU |
11 |
|
Graphiques du processeur |
Radeon RX Vega 11 Graphics |
Intel® Iris® Pro Graphics 5200 |
Device ID |
|
0xD22 |
Graphics base frequency |
|
200 MHz |
Graphics max dynamic frequency |
|
1.30 GHz |
Technologie Intel® Clear Video HD |
|
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Intel® Flexible Display Interface (Intel® FDI) |
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Technologie Intel® InTru™ 3D |
|
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Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
|
2 GB |
DisplayPort |
|
|
HDMI |
|
|
eDP |
|
|
Nombre d’écrans soutenu |
|
3 |
VGA |
|
|
Soutien du Wireless Display (WiDi) |
|
|
DirectX |
12 |
11.2/12 |
OpenGL |
|
4.3 |
Prise courants soutenu |
AM4 |
FCBGA1364 |
Thermal Design Power (TDP) |
35 Watt |
65 Watt |
Thermal Solution |
Not included |
|
Low Halogen Options Available |
|
|
Nombre de CPUs maximale dans une configuration |
|
1 |
Package Size |
|
37.5mm x 32mm x 1.65mm |
Révision PCI Express |
3.0 x8 |
3.0 |
Nombre maximale des voies PCIe |
|
16 |
PCIe configurations |
|
Up to 1x16, 2x8, 1x8/2x4 |
Scalability |
|
1S Only |
AMD VR Ready Processors |
|
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Technologie Enhanced Intel SpeedStep® |
|
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Flexible Display interface (FDI) |
|
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Idle States |
|
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Extensions de l’ensemble d’instructions |
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Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
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Intel® Advanced Vector Extensions (AVX) |
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Intel® AES New Instructions |
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Technologie Intel® Hyper-Threading |
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Technologie Intel® My WiFi |
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Intel® Stable Image Platform Program (SIPP) |
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Intel® TSX-NI |
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Technologie Intel® Turbo Boost |
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Intel® vPro™ Platform Eligibility |
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Thermal Monitoring |
|
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Résolution maximale sur DisplayPort |
|
3840x2160@60Hz |
Résolution maximale sur eDP |
|
3840x2160@60Hz |
Résolution maximale sur HDMI 1.4 |
|
3840x2160@60Hz |
Résolution maximale sur VGA |
|
2880x1800@60Hz |
Technologie Anti-Theft |
|
|
Execute Disable Bit (EDB) |
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Technologie Intel® Identity Protection |
|
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Intel® OS Guard |
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Technologie Intel® Secure Key |
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Technologie Intel® Trusted Execution (TXT) |
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Intel® Virtualization Technology (VT-x) |
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Intel® Virtualization Technology for Directed I/O (VT-d) |
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Intel® VT-x with Extended Page Tables (EPT) |
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