Nom de code de l’architecture |
Comet Lake |
|
Date de sortie |
Q2'20 |
|
Prix de sortie (MSRP) |
$122 |
|
Position dans l’évaluation de la performance |
1090 |
1100 |
Processor Number |
i3-10100T |
|
Série |
10th Generation Intel Core i3 Processors |
AMD Business Class - Quad-Core A10-Series APU for Desktops |
Status |
Launched |
|
Segment vertical |
Desktop |
Desktop |
Family |
|
AMD A-Series Processors |
OPN Tray |
|
AD680BWOA44HL |
Soutien de 64-bit |
|
|
Base frequency |
3.00 GHz |
4.1 GHz |
Bus Speed |
8 GT/s |
|
Cache L3 |
6 MB |
|
Processus de fabrication |
14 nm |
32 nm SOI |
Température de noyau maximale |
100°C |
74°C |
Fréquence maximale |
3.80 GHz |
4.4 GHz |
Nombre de noyaux |
4 |
4 |
Nombre de fils |
8 |
4 |
Cache L1 |
|
192 KB |
Cache L2 |
|
4 MB |
Ouvert |
|
|
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
41.6 GB/s |
|
Taille de mémore maximale |
128 GB |
|
Genres de mémoire soutenus |
DDR4-2666 |
|
Supported memory frequency |
|
2133 MHz |
Device ID |
0x9BC8 |
|
Graphics base frequency |
350 MHz |
|
Graphics max dynamic frequency |
1.10 GHz |
|
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
64 GB |
|
Graphiques du processeur |
Intel UHD Graphics 630 |
AMD Radeon HD 8670D |
Enduro |
|
|
Freéquency maximale des graphiques |
|
844 MHz |
Compte de noyaux iGPU |
|
384 |
Graphiques changeables |
|
|
Unified Video Decoder (UVD) |
|
|
Video Codec Engine (VCE) |
|
|
Nombre d’écrans soutenu |
3 |
|
DisplayPort |
|
|
HDMI |
|
|
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
4096x2304@60Hz |
|
Résolution maximale sur eDP |
4096x2304@60Hz |
|
Résolution maximale sur HDMI 1.4 |
4096x2160@30Hz |
|
DirectX |
12 |
11 |
OpenGL |
4.5 |
|
Configurable TDP-down |
25 Watt |
|
Configurable TDP-down Frequency |
2.40 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
|
Package Size |
37.5mm x 37.5mm |
|
Prise courants soutenu |
FCLGA1200 |
FM2 |
Thermal Design Power (TDP) |
35 Watt |
45 Watt |
Thermal Solution |
PCG 2015B |
|
Nombre maximale des voies PCIe |
16 |
|
Révision PCI Express |
3.0 |
|
PCIe configurations |
Up to 1x16, 2x8, 1x8+2x4 |
|
Scalability |
1S Only |
|
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Secure Boot |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
|
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® Thermal Velocity Boost |
|
|
Technologie Intel® Turbo Boost |
|
|
Thermal Monitoring |
|
|
AMD App Acceleration |
|
|
AMD Elite Experiences |
|
|
AMD HD3D technology |
|
|
Enhanced Virus Protection (EVP) |
|
|
Fused Multiply-Add 4 (FMA4) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
PowerGating |
|
|
PowerNow |
|
|
RAID |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
AMD Virtualization (AMD-V™) |
|
|
IOMMU 2.0 |
|
|