Nom de code de l’architecture |
Rocket Lake |
Skylake |
Date de sortie |
16 Mar 2021 |
Q3'15 |
Prix de sortie (MSRP) |
$213 |
|
Position dans l’évaluation de la performance |
709 |
682 |
Processor Number |
i5-11600T |
i3-6300T |
Série |
11th Generation Intel Core i5 Processors |
6th Generation Intel® Core™ i3 Processors |
Status |
Launched |
Launched |
Segment vertical |
Desktop |
Desktop |
Soutien de 64-bit |
|
|
Base frequency |
1.70 GHz |
3.30 GHz |
Bus Speed |
8 GT/s |
8 GT/s DMI3 |
Cache L1 |
384 KB |
|
Cache L2 |
3 MB |
|
Cache L3 |
12 MB |
|
Processus de fabrication |
14 nm |
14 nm |
Température de noyau maximale |
100°C |
66°C |
Fréquence maximale |
4.10 GHz |
|
Nombre de noyaux |
|
2 |
Nombre de fils |
|
4 |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
50 GB/s |
34.1 GB/s |
Taille de mémore maximale |
128 GB |
64 GB |
Genres de mémoire soutenus |
DDR4-3200 |
DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
Device ID |
0x4C8A |
0x1912 |
Unités d’éxécution |
32 |
|
Graphics base frequency |
350 MHz |
350 MHz |
Graphics max dynamic frequency |
1.30 GHz |
950 MHz |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
64 GB |
64 GB |
Graphiques du processeur |
Intel UHD Graphics 750 |
Intel® HD Graphics 530 |
Nombre d’écrans soutenu |
3 |
3 |
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
5120 x 3200 @60Hz |
4096x2304@60Hz |
Résolution maximale sur eDP |
5120 x 3200 @60Hz |
4096x2304@60Hz |
Résolution maximale sur HDMI 1.4 |
|
4096x2304@24Hz |
DirectX |
12.1 |
12 |
OpenGL |
4.5 |
4.5 |
Configurable TDP-down |
25 Watt |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
37.5 mm x 37.5 mm |
37.5mm x 37.5mm |
Prise courants soutenu |
FCLGA1200 |
FCLGA1151 |
Thermal Design Power (TDP) |
35 Watt |
35 Watt |
Thermal Solution |
PCG 2019D |
PCG 2015A (35W) |
Low Halogen Options Available |
|
|
Nombre maximale des voies PCIe |
20 |
16 |
Révision PCI Express |
4.0 |
3.0 |
PCIe configurations |
Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 |
Up to 1x16, 2x8, 1x8+2x4 |
Scalability |
1S Only |
1S Only |
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Secure Boot |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® Thermal Velocity Boost |
|
|
Technologie Intel® Turbo Boost |
|
|
Thermal Monitoring |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|