Nom de code de l’architecture |
Tiger Lake |
Skylake |
Date de sortie |
2 Sep 2020 |
Q4'15 |
Prix de sortie (MSRP) |
$426 |
|
Position dans l’évaluation de la performance |
778 |
780 |
Processor Number |
i7-1185G7 |
i3-6100TE |
Série |
11th Generation Intel Core i7 Processors |
6th Generation Intel® Core™ i3 Processors |
Status |
Launched |
Launched |
Segment vertical |
Mobile |
Embedded |
Soutien de 64-bit |
|
|
Bus Speed |
4 GT/s |
8 GT/s DMI3 |
Cache L1 |
384 KB |
|
Cache L2 |
5 MB |
|
Cache L3 |
12 MB |
|
Processus de fabrication |
10 nm SuperFin |
14 nm |
Température de noyau maximale |
100C |
|
Fréquence maximale |
4.80 GHz |
|
Nombre de noyaux |
4 |
2 |
Nombre de fils |
8 |
4 |
Base frequency |
|
2.70 GHz |
Réseaux de mémoire maximale |
2 |
2 |
Taille de mémore maximale |
64 GB |
64 GB |
Genres de mémoire soutenus |
DDR4-3200, LPDDR4x-4267 |
DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
Bande passante de mémoire maximale |
|
34.1 GB/s |
Device ID |
0x9A49 |
0x1912 |
Unités d’éxécution |
96 |
|
Graphics max dynamic frequency |
1.35 GHz |
1.00 GHz |
Technologie Intel® Clear Video HD |
|
|
Intel® Quick Sync Video |
|
|
Graphiques du processeur |
Intel Iris Xe Graphics |
Intel® HD Graphics 530 |
Graphics base frequency |
|
350 MHz |
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Mémoire de vidéo maximale |
|
64 GB |
Nombre d’écrans soutenu |
4 |
3 |
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Résolution maximale sur DisplayPort |
7680x4320@60Hz |
4096x2304@60Hz |
Résolution maximale sur eDP |
4096x2304@60Hz |
4096x2304@60Hz |
Soutien de la resolution 4K |
|
|
Résolution maximale sur HDMI 1.4 |
|
4096x2304@24Hz |
DirectX |
12.1 |
12 |
OpenGL |
4.6 |
4.5 |
Configurable TDP-down |
12 Watt |
|
Configurable TDP-down Frequency |
1.20 GHz |
|
Configurable TDP-up |
28 Watt |
|
Configurable TDP-up Frequency |
3.00 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
46.5x25 |
37.5mm x 37.5mm |
Prise courants soutenu |
FCBGA1449 |
FCLGA1151 |
Low Halogen Options Available |
|
|
Thermal Design Power (TDP) |
|
35 Watt |
Thermal Solution |
|
PCG 2015A (35W) |
Intel® OS Guard |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Mode-based Execute Control (MBE) |
|
|
Secure Boot |
|
|
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Technologie Intel® Secure Key |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® Volume Management Device (VMD) |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Intel 64 |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
Nombre maximale des voies PCIe |
|
16 |
Révision PCI Express |
|
3.0 |
PCIe configurations |
|
Up to 1x16, 2x8, 1x8+2x4 |
Scalability |
|
1S Only |