Nom de code de l’architecture |
Whiskey Lake |
Skylake |
Date de sortie |
Q2'19 |
Q4'15 |
Prix de sortie (MSRP) |
$409 |
|
Position dans l’évaluation de la performance |
1519 |
1515 |
Processor Number |
i7-8665UE |
i5-6442EQ |
Série |
8th Generation Intel Core i7 Processors |
6th Generation Intel® Core™ i5 Processors |
Status |
Launched |
Launched |
Segment vertical |
Embedded |
Embedded |
Soutien de 64-bit |
|
|
Base frequency |
1.70 GHz |
1.90 GHz |
Cache L1 |
256 KB |
|
Cache L2 |
1 MB |
|
Cache L3 |
8 MB |
|
Processus de fabrication |
14 nm |
14 nm |
Température de noyau maximale |
100 °C |
100°C |
Fréquence maximale |
4.40 GHz |
2.70 GHz |
Nombre de noyaux |
4 |
4 |
Nombre de fils |
8 |
4 |
Bus Speed |
|
8 GT/s DMI3 |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
37.5 GB/s |
34.1 GB/s |
Taille de mémore maximale |
64 GB |
64 GB |
Genres de mémoire soutenus |
DDR4-2400, LPDDR3-2133 |
DDR4-2133, LPDDR3-1866, DDR3L-1600 |
Unités d’éxécution |
24 |
|
Graphics base frequency |
300 MHz |
350 MHz |
Graphics max dynamic frequency |
1.15 GHz |
1.00 GHz |
Intel® Quick Sync Video |
|
|
Graphiques du processeur |
Intel UHD Graphics 620 |
Intel® HD Graphics 530 |
Device ID |
|
0x191B |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Mémoire de vidéo maximale |
|
64 GB |
DisplayPort |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
DVI |
|
|
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
4096x2304@60Hz |
4096x2304@60Hz |
Résolution maximale sur eDP |
4096x2304@60Hz |
4096x2304@60Hz |
Résolution maximale sur HDMI 1.4 |
4096x2160@30/24Hz |
4096x2304@24Hz |
DirectX |
12 |
12 |
OpenGL |
4.5 |
4.5 |
Configurable TDP-down |
12.5 Watt |
|
Configurable TDP-down Frequency |
1.30 GHz |
|
Configurable TDP-up |
25 Watt |
|
Configurable TDP-up Frequency |
2.00 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
46 x 24 |
42mm x 28mm |
Prise courants soutenu |
FCBGA1528 |
FCBGA1440 |
Thermal Design Power (TDP) |
15 Watt |
25 Watt |
Low Halogen Options Available |
|
|
Nombre maximale des voies PCIe |
16 |
16 |
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
Up to 1x16, 2x8, 1x8+2x4 |
Execute Disable Bit (EDB) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Secure Boot |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|